Patents by Inventor Janet Okada-Coakley

Janet Okada-Coakley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive composition
    Patent number: 8455175
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 4, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. Winkle, Jill E. Steeper, Xiang-Qian Liu, Janet Okada-Coakley, Scott A. Ibbitson
  • PHOTOSENSITIVE COMPOSITION
    Publication number: 20110262861
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Application
    Filed: April 26, 2011
    Publication date: October 27, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. WINKLE, Jill E. STEEPER, Xiang-Qian LIU, Janet OKADA-COAKLEY, Scott A. IBBITSON
  • Photosensitive composition
    Patent number: 7932016
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: April 26, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark R. Winkle, Jill E. Steeper, Xiang-Qian Liu, Janet Okada-Coakley, Scott A. Ibbitson
  • Photosensitive composition
    Publication number: 20070105046
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 10, 2007
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Mark Winkle, Jill Steeper, Xiang-Qian Liu, Janet Okada-Coakley, Scott Ibbitson