Patents by Inventor JANG-HONG KIM

JANG-HONG KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH CAPACITOR FORMED UNDER BONDING PAD
    Publication number: 20020113287
    Abstract: A semiconductor device is provided which includes a semiconductor substrate having a main surface. A bonding pad is formed on the main surface. A multi-layer wiring structure is disposed between the main surface and the bonding pad. The multi-layer wiring structure includes a first wiring layer, a second wiring layer, and an interlayer insulating film therebetween. The first layer, the second layer, and the interlayer film form a capacitor disposed under the bonding pad.
    Type: Application
    Filed: July 13, 1999
    Publication date: August 22, 2002
    Inventors: SANG-HEON LEE, JANG-HONG KIM