Patents by Inventor Jang Hoon JEONG

Jang Hoon JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting module, flash module, and terminal including same
    Patent number: 11300854
    Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: April 12, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Tae Sung Lee, Jang Hoon Jeong, Min Ji Jin, Young Kyu Jeong
  • LIGHT EMITTING MODULE, FLASH MODULE, AND TERMINAL INCLUDING SAME
    Publication number: 20210286235
    Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.
    Type: Application
    Filed: August 8, 2017
    Publication date: September 16, 2021
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Tae Sung LEE, Jang Hoon JEONG, Min Ji JIN, Young Kyu JEONG