Patents by Inventor Jang Hwang JEON

Jang Hwang JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11550371
    Abstract: The present disclosure relates to a display apparatus. The display apparatus may include a display panel, a peripheral region, an electronic component, and a gap-fill layer. The display panel defines a display region. The peripheral region is adjacent to the display region. The peripheral region includes lines and pads. The lines are disposed in the peripheral region, and the pads are connected to the lines. The electronic component includes connecting pads in contact with the pads. The gap-fill layer is between the display panel and the electronic component, between the connection pads, between the pads, and in the openings. Each of the pads may overlap at least two pads of the connection pads, and the openings may overlap between the connection pads, when viewed in a plan view.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 10, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Daegeun Lee, Sujeong Kim, Jang-Hwang Jeon
  • Publication number: 20210181814
    Abstract: The present disclosure relates to a display apparatus. The display apparatus may include a display panel, a peripheral region, an electronic component, and a gap-fill layer. The display panel defines a display region. The peripheral region is adjacent to the display region. The peripheral region includes lines and pads. The lines are disposed in the peripheral region, and the pads are connected to the lines. The electronic component includes connecting pads in contact with the pads. The gap-fill layer is between the display panel and the electronic component, between the connection pads, between the pads, and in the openings. Each of the pads may overlap at least two pads of the connection pads, and the openings may overlap between the connection pads, when viewed in a plan view.
    Type: Application
    Filed: August 4, 2020
    Publication date: June 17, 2021
    Inventors: Daegeun LEE, Sujeong KIM, Jang-Hwang JEON
  • Patent number: 10234999
    Abstract: An apparatus for sensing a touch pressure includes: a substrate; a touch sensor provided on one surface of the substrate; a first pressure sensing electrode provided on the other surface opposite to the one surface of the substrate; a protective layer provided on the first pressure sensing electrode, the protective layer including a first opening area through which a portion of the first pressure sensing electrode is exposed; a flexible circuit board electrically connecting the touch sensor and the first pressure sensing electrode to each other; and a conductive member disposed in the first opening area, the conductive member electrically connecting the first pressure sensing electrode and the flexible circuit board to each other.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: March 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ji Yeon Baek, Ji Yun Bang, Seung Min Lee, Jang Hwang Jeon, Chang Sub Jung
  • Publication number: 20180039357
    Abstract: An apparatus for sensing a touch pressure includes: a substrate; a touch sensor provided on one surface of the substrate; a first pressure sensing electrode provided on the other surface opposite to the one surface of the substrate; a protective layer provided on the first pressure sensing electrode, the protective layer including a first opening area through which a portion of the first pressure sensing electrode is exposed; a flexible circuit board electrically connecting the touch sensor and the first pressure sensing electrode to each other; and a conductive member disposed in the first opening area, the conductive member electrically connecting the first pressure sensing electrode and the flexible circuit board to each other.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 8, 2018
    Inventors: Ji Yeon BAEK, Ji Yun BANG, Seung Min LEE, Jang Hwang JEON, Chang Sub JUNG