Patents by Inventor Jang Hyun-Ji

Jang Hyun-Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder Paste for Connection Pin
    Publication number: 20250058413
    Abstract: In one aspect of the present invention, a solder paste for connection pins is provided, comprising: solder powder that includes tin, has a mean diameter of 3˜5 ?m, and wherein the proportion of powder particles with a diameter of 8 ?m or more is less than 1 wt %; and a flux that enhances the wettability of the aforementioned solder powder.
    Type: Application
    Filed: December 7, 2023
    Publication date: February 20, 2025
    Inventors: Oh Heebong, Park Soon-Ho, Eun Dong Jin, Pyun Min Wook, Jang Hyun-Ji, Kim Kyung Tae, Kim Jin-Gyu, Kim Min-Woo
  • Semiconductor Package
    Publication number: 20250062200
    Abstract: In one aspect of the present invention, the connection pin comprises a columnar structure with a diameter ranging from 60 to 500 micrometers (?m) and an aspect ratio (length to diameter) ranging from 1 to 10. Furthermore, the angle formed between the horizontal and vertical surfaces of the said structure is characterized by being between 90°±3°.
    Type: Application
    Filed: December 7, 2023
    Publication date: February 20, 2025
    Inventors: Oh Heebong, Park Soon-Ho, Eun Dong Jin, Pyun Min Wook, Jang Hyun-Ji, Park Eun Kwang, Kim Jin-Gyu, Lee Chan-Gyu