Patents by Inventor Jang Jin LEE

Jang Jin LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150985
    Abstract: Proposed is a detachable mooring system for an offshore structure, including a first tension adjuster connected to an offshore structure, and blocking a pulling chain from proceeding from an outlet of a body toward an inlet, a second tension adjuster connected to one end of the pulling chain and blocking the pulling chain from proceeding from an outlet of a body toward an inlet, a mooring chain having a first longitudinal end connected to one surface of the second tension adjuster body and having a second longitudinal end connected to an anchor on the seabed, a first lead rope having one longitudinal end connected to one end of the pulling chain discharged out through the first tension adjuster outlet, and a second lead rope having one longitudinal end connected to the second tension adjuster body.
    Type: Application
    Filed: January 3, 2024
    Publication date: May 9, 2024
    Applicants: KOREA INSTITUTE OF OCEAN SCIENCE & TECHNOLOGY, KOMS INC., DHMC CO., LTD.
    Inventors: Kang Su LEE, Hong Gun SUNG, Byoung Jae PARK, Jang Jin KIM, Hyun Kook KIM, Chang Hwan SEO, Kyung Seok LEE, Yoon Yong PARK
  • Publication number: 20240112949
    Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Sung Jin KANG, Jong Min BAEK, Woo Kyung YOU, Kyu-Hee HAN, Han Seong KIM, Jang Ho LEE, Sang Shin JANG
  • Publication number: 20240098275
    Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 21, 2024
    Inventors: Je Chang JEONG, Ki Baek KIM, Won Jin LEE, Hye Jin SHIN, Jong Sang YOO, Jang Hyeok YUN, Kyung Jun LEE, Jae Hun KIM, Sang Gu LEE
  • Patent number: 11923216
    Abstract: An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 5, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEMES CO., LTD.
    Inventors: Seung Min Shin, Sang Jin Park, Hae Won Choi, Jang Jin Lee, Ji Hwan Park, Kun Tack Lee, Koriakin Anton, Joon Ho Won, Jin Yeong Sung, Pil Kyun Heo
  • Publication number: 20230197481
    Abstract: An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.
    Type: Application
    Filed: August 22, 2022
    Publication date: June 22, 2023
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEMES CO., LTD.
    Inventors: Seung Min SHIN, Sang Jin PARK, Hae Won CHOI, Jang Jin LEE, Ji Hwan PARK, Kun Tack LEE, Koriakin ANTON, Joon Ho WON, Jin Yeong SUNG, Pil Kyun HEO
  • Publication number: 20220290921
    Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space; and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 15, 2022
    Applicant: SEMES CO., LTD.
    Inventors: Hae-Won CHOI, Anton KORIAKIN, Joon Ho WON, Min Woo KIM, Ki Hoon CHOI, Eung Su KIM, Tae Hee KIM, Pil Kyun HEO, Jang Jin LEE, Jin Yeong SUNG