Patents by Inventor Jang-Kyu Kang

Jang-Kyu Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing high performance ball grid array board and jig applicable to said method
    Publication number: 20030019574
    Abstract: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.
    Type: Application
    Filed: October 29, 2001
    Publication date: January 30, 2003
    Inventors: Myung-Sam Kang, Keon-Yang Park, Jang-Kyu Kang