Patents by Inventor Jang My

Jang My has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Holder for surface mount device during reflow
    Patent number: 7295445
    Abstract: Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with the substrate, a conductive bonding material coupled with the plurality of terminals, an electronic device coupled with the conductive bonding material, and a holder that is coupled with the substrate to hold the electronic device. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed therebetween, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: November 13, 2007
    Assignee: Intel Corporation
    Inventor: Jang My
  • Holder for surface mount device during reflow
    Publication number: 20060067065
    Abstract: Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with the substrate, a conductive bonding material coupled with the plurality of terminals, an electronic device coupled with the conductive bonding material, and a holder that is coupled with the substrate to hold the electronic device. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed therebetween, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventor: Jang My