Patents by Inventor Jang-Seob Choi

Jang-Seob Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for treating substrate
    Patent number: 7323080
    Abstract: The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: January 29, 2008
    Assignee: Semes Co., Ltd.
    Inventors: In-Jun Kim, Jung-Keun Cho, Jang-Seob Choi, Yong-Nam Choi, Jeong-Yong Bae
  • Apparatus and method for treating substrate
    Publication number: 20050247667
    Abstract: The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.
    Type: Application
    Filed: March 21, 2005
    Publication date: November 10, 2005
    Inventors: In-Jun Kim, Jung-Keun Cho, Jang-Seob Choi, Yong-Nam Choi, Jeong-Yong Bae