Patents by Inventor Jang Seok Lee

Jang Seok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090013710
    Abstract: A refrigerator and a method for manufacturing the same. The refrigerator includes a main body which has a specified space and a open front surface, and a plate having a specified thickness, in which the plate is inserted into the main body through one side of the open front surface of the main body to sectionalize the space provided in the main body.
    Type: Application
    Filed: July 2, 2008
    Publication date: January 15, 2009
    Inventors: Nam Soo CHO, Youn Seok Lee, Kyeong Yun Kim, Su Nam Chae, Sang Oh Kim, Jang Seok Lee
  • Publication number: 20090013713
    Abstract: A refrigerator including a body having a plurality of cooling compartments separated from each other by a partition, and a machine room defined by the partition in a lower region of one of the plurality of cooling compartments. The machine room receives predetermined elements required to operate the cooling compartments.
    Type: Application
    Filed: July 10, 2008
    Publication date: January 15, 2009
    Inventors: Nam Soo CHO, Youn Seok Lee, Kyeong Yun Kim, Su Nam Chae, Jang Seok Lee
  • Publication number: 20080164016
    Abstract: A condenser for a refrigerator includes an inline arrangement in which a refrigerant tube is arranged such that refrigerant tube parts are arranged in lines in the forward and backward direction, and a staggered arrangement in which the refrigerant tube parts are arranged at the rear side of the inline arrangement in the forward and backward direction to misaligned with each other, such that the difference of air flow between a front side and a rear side thereof is minimized when heat exchange with ambient air in the condenser is performed by blowing operation of a cooling fan installed to a side of the condenser.
    Type: Application
    Filed: November 26, 2004
    Publication date: July 10, 2008
    Applicant: LG Electronics
    Inventors: Jang-Seok Lee, Kyeong-Yun Kim, Sung Jhee, Nam-Soo Cho, Kyong-Bae Park
  • Publication number: 20070130770
    Abstract: A refrigerant leak-preventive structure in a heat exchanger is described. The refrigerant leak-preventive structure includes a tube group having refrigerant leak-preventive grooves recessed at ends of the fin-tubes group, and headers having refrigerant leak-preventive projections formed by double injection molding solution introduced into and cooled in the refrigerant leak-preventive grooves when being coupled with the both ends of the tube group by a double injection molding.
    Type: Application
    Filed: January 30, 2007
    Publication date: June 14, 2007
    Applicant: LG ELECTRONICS INC.
    Inventor: Jang Seok LEE
  • Patent number: 7155926
    Abstract: A refrigerator includes: a refrigerator body having a cooling chamber for storing food items and a mechanic chamber provided at one side thereof; a heat exchanger disposed in the mechanic chamber and performing heat exchanging while a refrigerant passes therethrough; a cross flow fan disposed facing the heat exchanger and blowing air for heat exchange; and a compressor mounted inside the mechanic chamber and compressing a refrigerant. A space for the mechanic chamber can be reduced, and thus, a cooling chamber for keeping food items can be enlarged.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: January 2, 2007
    Assignee: LG Electronics Inc.
    Inventors: Su-Nam Chae, Moo-Youl Kim, Joon-Hwan Oh, Tae-Hee Lee, Kyeong-Yun Kim, Jang-Seok Lee, Sung Jhee, Nam Soo Cho
  • Patent number: 7059394
    Abstract: A heat exchanger comprising a plurality of refrigerant pipes bent many times for passing a refrigerant for heat exchange; and cooling fins arranged at an outer circumference surface of the refrigerant pipes for expanding a contact area of air which passes through the refrigerant pipes, wherein a direction that the refrigerant pipes are bent is a major axis and a perpendicular direction to the major axis is a minor axis. In the heat exchanger, a bending portion of the refrigerant pipe is prevented from being distorted thus to have a smooth refrigerant flow and enhance a heat exchange performance.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: June 13, 2006
    Assignee: LG Electronics Inc.
    Inventors: Nam Soo Cho, Jang Seok Lee, Sung Jhee
  • Patent number: 7030344
    Abstract: A defroster for a heat exchanger includes a heat transfer plate on the heat exchanger; a thin film heater arranged on the heat transfer plate; and a power supply wire connected to the film heater for supplying power to the film heater. The defroster can be fabricated by forming a masking layer with a certain shape on an electrically resistant substrate; patterning a thin film heater on the substrate based on the shape of the masking layer; adhering the film heater to a heat transfer plate; and connecting a power supply to the film heater. Accordingly, it is possible to improve a defrosting performance of the heat exchanger and use an environment-friendly, alternative refrigerant with the relatively, low temperature defroster of the heat exchanger.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: April 18, 2006
    Assignee: LG Electronics Inc.
    Inventors: Nam-Soo Cho, Sung Jhee, Jang Seok Lee
  • Publication number: 20050160760
    Abstract: A refrigerator includes: a refrigerator body having a cooling chamber for storing food items and a mechanic chamber provided at one side thereof; a heat exchanger disposed in the mechanic chamber and performing heat exchanging while a refrigerant passes therethrough; a cross flow fan disposed facing the heat exchanger and blowing air for heat exchange; and a compressor mounted inside the mechanic chamber and compressing a refrigerant. A space for the mechanic chamber can be reduced, and thus, a cooling chamber for keeping food items can be enlarged.
    Type: Application
    Filed: December 3, 2004
    Publication date: July 28, 2005
    Applicant: LG ELECTRONICS INC.
    Inventors: Su-Nam Chae, Moo-Youl Kim, Joon-Hwan Oh, Tae-Hee Lee, Kyeong-Yun Kim, Jang-Seok Lee, Sung Jhee, Nam Cho
  • Publication number: 20040200597
    Abstract: A defroster for a heat exchanger includes a heat transfer plate on the heat exchanger; a thin film heater arranged on the heat transfer plate; and a power supply wire connected to the film heater for supplying power to the film heater. The defroster can be fabricated by forming a masking layer with a certain shape on an electrically resistant substrate; patterning a thin film heater on the substrate based on the shape of the masking layer; adhering the film heater to a heat transfer plate; and connecting a power supply to the film heater. Accordingly, it is possible to improve a defrosting performance of the heat exchanger and use an environment-friendly, alternative refrigerant with the relatively, low temperature defroster of the heat exchanger.
    Type: Application
    Filed: December 30, 2003
    Publication date: October 14, 2004
    Inventors: Nam-Soo Cho, Sung Jhee, Jang Seok Lee
  • Publication number: 20040194935
    Abstract: A heat exchanger comprising a plurality of refrigerant pipes bent many times for passing a refrigerant for heat exchange; and cooling fins arranged at an outer circumference surface of the refrigerant pipes for expanding a contact area of air which passes through the refrigerant pipes, wherein a direction that the refrigerant pipes are bent is a major axis and a perpendicular direction to the major axis is a minor axis. In the heat exchanger, a bending portion of the refrigerant pipe is prevented from being distorted thus to have a smooth refrigerant flow and enhance a heat exchange performance.
    Type: Application
    Filed: December 23, 2003
    Publication date: October 7, 2004
    Applicant: LG Electronics Inc.
    Inventors: Nam Soo Cho, Jang Seok Lee, Sung Jhee
  • Publication number: 20040188076
    Abstract: Disclosed herein is a heat exchanger in which a header in the heat exchanger is made of a material of plastic so that a regulator plate to define a passage of pipe can be formed freely. Also, not only a passage between pipes but also a passage between fine tubes in the same pipe can be formed. Accordingly, formation of a passage to accomplish maximal heat exchange efficiency is possible.
    Type: Application
    Filed: November 10, 2003
    Publication date: September 30, 2004
    Inventor: Jang Seok Lee
  • Publication number: 20040177948
    Abstract: A heat exchanger includes: refrigerator pipes arranged at regular intervals; and cooling pins arranged between the refrigerator pipes and integrally formed with the refrigerator pipes. A fabrication process and cost can be reduced, a heat transfer performance can be enhanced, and the life span of the heat exchanger can be lengthened.
    Type: Application
    Filed: November 13, 2003
    Publication date: September 16, 2004
    Applicant: LG Electronics Inc.
    Inventors: Nam Soo Cho, Jang Seok Lee, Sung Jhee
  • Publication number: 20040040699
    Abstract: Disclosed is a refrigerant leak-preventive structure in a heat exchanger. The refrigerant leak-preventive structure comprises: a fin-tubes group having refrigerant leak-preventive grooves recessed at ends of the fin-tubes group; and headers having refrigerant leak-preventive projections formed by double injection molding solution introduced into and cooled in the refrigerant leak-preventive grooves when being coupled with the both ends of the fin-tubes group by a double injection molding.
    Type: Application
    Filed: February 20, 2003
    Publication date: March 4, 2004
    Applicant: LG Electronics Inc.
    Inventor: Jang Seok Lee
  • Patent number: 6691530
    Abstract: The present invention relates to a rapid cooling apparatus for rapidly cooling objects at room temperature via conductive heat transfer and convective heat transfer as well. The rapid cooling apparatus comprises: means having a storage space disposed inside a first storage housing for storing the objects to be cooled and cold material bags disposed around the received objects to be cooled; means for driving the storage means in a direction; and means for spacing the storage and driving means from a second storage housing. The invention provides a user with convenience via rapid cooling and also can enhance cooling efficiency.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: February 17, 2004
    Assignee: LG Electronics Inc.
    Inventors: Myung Ryul Lee, Seong Jae Kim, Jang Seok Lee
  • Publication number: 20030209029
    Abstract: The present invention relates to a rapid cooling apparatus for rapidly cooling objects at room temperature via conductive heat transfer and convective heat transfer as well. The rapid cooling apparatus comprises: means having a storage space disposed inside a first storage housing for storing the objects to be cooled and cold material bags disposed around the received objects to be cooled; means for driving the storage means in a direction; and means for spacing the storage and driving means from a second storage housing. The invention provides a user with convenience via rapid cooling and also can enhance cooling efficiency.
    Type: Application
    Filed: September 17, 2002
    Publication date: November 13, 2003
    Applicant: LG Electronics Inc.
    Inventors: Myung Ryul Lee, Seong Jae Kim, Jang Seok Lee
  • Patent number: 6554929
    Abstract: Disclosed is a method for joining tube headers and header tanks of a heat exchanger made of a plastic material by joining fin-tube units of a fin-tube assembly with tube headers in accordance with a thermal fusing method while joining the fin-tube units with each header tank in accordance with a fusing method using ultrasonic waves.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: April 29, 2003
    Assignee: LG Electronics Inc.
    Inventor: Jang Seok Lee
  • Patent number: 6488080
    Abstract: An integrated refrigerator evaporator having a plurality of pipes and fins is manufactured by injection molding with plastics. According to the present invention, pipes and fins are molded by plastic plates, and a heat exchanger is formed by molding the pipes and fins into a series of “S” shapes. A first bending section formed by the heat exchanger, which is molded in a series of “S” shapes, is inserted into a mold main body to manufacture a header cap. A first header cap is manufactured by injected melted plastic material body into the mold main body under the state of covering the mold main body with a mold cap. The first header cap is engaged with a first header main body having a refrigerant inlet and outlet. The refrigerator evaporator according to the present invention results in a relatively lower product cost than the evaporator composed of a metal substance, as well as a high recyclability.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: December 3, 2002
    Assignee: LG Electronics Inc.
    Inventors: Tae Hee Lee, Jang Seok Lee, Sang Wook Lee, Se Yoon Oh
  • Publication number: 20020088526
    Abstract: Disclosed is a method for joining tube headers and header tanks of a heat exchanger made of a plastic material by joining fin-tube units of a fin-tube assembly with tube headers in accordance with a thermal fusing method while joining the fin-tube units with each header tank in accordance with a fusing method using ultrasonic waves.
    Type: Application
    Filed: September 18, 2001
    Publication date: July 11, 2002
    Inventor: Jang Seok Lee
  • Publication number: 20010013408
    Abstract: Disclosed an integrated refrigerator evaporator having a plurality of pipes and fins which is manufactured by injection molding with plastics. According to the present invention, pipes and fins are molded by means of at least one plastic plates, and a heat exchanger is formed by molding the pipes and fins in a series of “S” shape. A first bending section formed by the heat exchanger, which is molded in a series of “S” shape, is inserted into a mold main body to manufacture a header cap. A first header cap is manufactured by injecting melted plastic material body into the mold main body under the state of covering a mold cap. The first header cap is engaged with a first header main body comprising the first header cap and the refrigerant inlet and outlet. The refrigerator evaporator according to the present invention results in a relatively lower product cost than the evaporator composed of a metal substance as well as a high recyclability.
    Type: Application
    Filed: December 4, 2000
    Publication date: August 16, 2001
    Inventors: Tae Hee Lee, Jang Seok Lee, Sang Wook Lee, Se Yoon Oh
  • Patent number: 6230511
    Abstract: Evaporator in a refrigerator, is disclosed, which has the refrigerant tube, cooling fins and the defrosting tube formed as one unit for simple structure and a better heat exchange efficiency, the evaporator including one pair of refrigerant tubes for flow of refrigerant therethrough, a defrosting tube disposed between the two refrigerant tubes, cooling fins formed as one unit with, and connecting the refrigerant tubes and the defrosting tube, turbulence forming means adapted to form a turbulence of air in a process of flowing around the evaporator for improving the heat exchange efficiency, internal heat conduction area enlarging means adapted to enlarge an internal area of the refrigerant tubes for improving the heat exchange efficiency, and external heat conduction area enlarging means adapted to enlarge an external area of the refrigerant tubes for improving the heat exchange efficiency.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: May 15, 2001
    Assignee: LG Electronics, Inc.
    Inventors: Jang Seok Lee, Jong Jin Park, Tae Hee Lee, Byung Jo Kim, Sang Wook Lee, Jeom Yul Yun, Bong Soo Hwang, Jong Jin Kim, Dong Won Kim, Gyong Hwan Kweon, Tae Hyun Kim