Patents by Inventor Jang Seok Yun
Jang Seok Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10643769Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.Type: GrantFiled: May 1, 2019Date of Patent: May 5, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Hyun Park, Jang Seok Yun, Kyung Seon Baek
-
Patent number: 10541069Abstract: A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.Type: GrantFiled: November 16, 2018Date of Patent: January 21, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jang-Seok Yun
-
Publication number: 20190259514Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.Type: ApplicationFiled: May 1, 2019Publication date: August 22, 2019Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Hyun Park, Jang Seok Yun, Kyung Seon Baek
-
Patent number: 10347404Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.Type: GrantFiled: July 18, 2017Date of Patent: July 9, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Hyun Park, Jang Seok Yun, Kyung Seon Baek
-
Publication number: 20190164672Abstract: A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.Type: ApplicationFiled: November 16, 2018Publication date: May 30, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventor: Jang-Seok YUN
-
Patent number: 10269474Abstract: A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (Cu—Mn—Sn) alloy. In the Cu—Mn—Sn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.Type: GrantFiled: July 14, 2017Date of Patent: April 23, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jang Seok Yun, Kwang Hyun Park, Kyung Seon Baek
-
Patent number: 10104776Abstract: A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.Type: GrantFiled: November 2, 2016Date of Patent: October 16, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Seok Yun, Hyung Min Kim, Jin Man Han
-
Publication number: 20180130578Abstract: A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (Cu—Mn—Sn) alloy. In the Cu—Mn—Sn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.Type: ApplicationFiled: July 14, 2017Publication date: May 10, 2018Inventors: Jang Seok YUN, Kwang Hyun PARK, Kyung Seon BAEK
-
Publication number: 20180122539Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.Type: ApplicationFiled: July 18, 2017Publication date: May 3, 2018Inventors: Kwang Hyun PARK, Jang Seok YUN, Kyung Seon BAEK
-
Publication number: 20170202089Abstract: A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.Type: ApplicationFiled: November 2, 2016Publication date: July 13, 2017Inventors: Jang Seok YUN, Hyung Min KIM, Jin Man HAN
-
Patent number: 9691838Abstract: A chip resistor includes a substrate having first and second electrodes disposed on one surface thereof to be separated from each other. A first resistor electrically connects the first electrode to the second electrode, and a second resistor electrically connects the first electrode to the second electrode. When temperatures of the first electrode and the second electrode are different from each other, thermo electromotive force generated from the first resistor is less than thermo electromotive force generated from the second resistor, and a temperature coefficient of resistivity (TCR) of the second resistor is lower than the TCR of the first resistor.Type: GrantFiled: August 5, 2016Date of Patent: June 27, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Man Han, Jang Seok Yun
-
Publication number: 20170179217Abstract: A chip resistor includes a substrate having first and second electrodes disposed on one surface thereof to be separated from each other. A first resistor electrically connects the first electrode to the second electrode, and a second resistor electrically connects the first electrode to the second electrode. When temperatures of the first electrode and the second electrode are different from each other, thermo electromotive force generated from the first resistor is less than thermo electromotive force generated from the second resistor, and a temperature coefficient of resistivity (TCR) of the second resistor is lower than the TCR of the first resistor.Type: ApplicationFiled: August 5, 2016Publication date: June 22, 2017Inventors: Jin Man HAN, Jang Seok YUN
-
Patent number: 8698593Abstract: There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).Type: GrantFiled: April 6, 2012Date of Patent: April 15, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jang Ho Park, Young Key Kim, Ki Won Suh, Jang Seok Yun, Jin Man Han, Sung Jun Kim
-
Publication number: 20130154790Abstract: There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).Type: ApplicationFiled: April 6, 2012Publication date: June 20, 2013Inventors: Jang Ho Park, Young Key Kim, Ki Won Suh, Jang Seok Yun, Jin Man Han, Sung Jun Kim