Abstract: The composition of the present invention includes a water-soluble soldering flux requiring no thermal energy to place the water-soluble flux in an active state. The water-soluble soldering flux contains (1) from about 1 percent to about 5 percent by weight, based on the weight of the water-soluble soldering flux, of an inorganic acid which, in solution, forms anions of the acid having a low propensity for forming metal complexes; (2) from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of an anionic surfactant; and (3) from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of a diluent. The composition of the present invention may contain a fourth component, a viscosity modifier from about 5 percent to about 40 percent by weight, based on total weight of the water-soluble soldering flux.

Abstract: The present invention relates to solder flux and solder paste compositions which do not require cleaning after the soldering operation.

Abstract: Solder flux compositions and pastes made therefrom, consisting essentially of solder metal powder, an amount of non-corrosive water soluble flux, said water soluble flux comprising a mixture of 2 non-corrosive water-soluble components, one of which is a non-halogenated amine, preferably triethanolamine and the other of which is an organic moiety with a polar group, preferably GAFAC RE-610.