Patents by Inventor Janice M. Giesler

Janice M. Giesler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board comprising elevated bond pads
    Patent number: 5523920
    Abstract: A printed circuit board (10) comprises a polymeric coating (30) and a metal circuit trace (26) applied to a substrate (22). The coating defines an opening (32) whereat the substrate is uncoated. The metal circuit trace includes a runner section (28) that is covered by the polymeric coating and a bond pad (20) integrally formed to the runner section at the opening and having an upper surface (40) that includes lip (36) overlying the polymer coating to facilitate positioning of a component for solder bonding to the pad. The bond pad preferably also includes a surface accessible within the opening to enhance solder bonding to the bond pad.
    Type: Grant
    Filed: January 3, 1994
    Date of Patent: June 4, 1996
    Assignee: Motorola, Inc.
    Inventors: Steven C. Machuga, Janice M. Giesler, Grace O'Malley, Charles A. McPherson