Patents by Inventor Janne LEHTINEN

Janne LEHTINEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940812
    Abstract: A method for a zone passage control system for an underground worksite having a plurality of operation zones for autonomously operating mobile vehicle operations includes the steps of associating a first passage control unit with a first zone and a second zone, detecting state parameter information of the first zone and the second zone, merging the first zone and the second zone into a fusion zone on the basis of the state parameter information of the first zone and the second zone, and adapting the zone passage control system to allow a first autonomously operating mobile vehicle to pass the first passage control unit in the fusion zone without interrupting operation of a second autonomously operating mobile vehicle in the first zone and/or the second zone.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: March 26, 2024
    Assignee: Sandvik Mining and Construction Oy
    Inventors: Janne Kallio, Antti Lehtinen, Jarkko Ruokojarvi
  • Publication number: 20240038680
    Abstract: A device for shielding at least one component from thermal radiation, the device comprising at least a first substrate with a first surface and a second surface and a second substrate with a first surface and second surface, the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements-comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.
    Type: Application
    Filed: February 17, 2022
    Publication date: February 1, 2024
    Inventors: Janne LEHTINEN, Antti KEMPPINEN, Emma MYKKÄNEN, Mika PRUNNILA, Alberto RONZANI
  • Publication number: 20240015936
    Abstract: A thermalization arrangement at cryogenic temperatures is disclosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further comprises a conductive layer between the substrate layer and the heat sink component. A joint between the substrate layer and the conductive layer has minimal phonon thermal boundary resistance. Energy of conductive layer phonons are arranged to be absorbed by electrons. Another joint between the conductive layer and the heat sink component is electrically conductive.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 11, 2024
    Inventors: Mika PRUNNILA, Alberto RONZANI, Emma MYKKÄNEN, Antti KEMPPINEN, Janne LEHTINEN
  • Patent number: 11800689
    Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: October 24, 2023
    Assignee: Teknologian tutkimuskeskus VTT Oy
    Inventors: Mika Prunnila, Alberto Ronzani, Emma Mykkänen, Antti Kemppinen, Janne Lehtinen
  • Publication number: 20220272869
    Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.
    Type: Application
    Filed: February 21, 2022
    Publication date: August 25, 2022
    Inventors: Mika PRUNNILA, Alberto RONZANI, Emma MYKKÄNEN, Antti KEMPPINEN, Janne LEHTINEN