Abstract: A component adapted to an environment exposed to corrosive species such as chlorine, which component has a substrate and a coating on the substrate configured to shield the substrate from erosion and corrosion. The coating is formed and metallurgically bonded to the substrate by nickel vapor depositing and hot isostatic pressing or by surface brazing. The coating is manufactured to form a dense layer consisting of a protective material that substantially reduces corrosion rate under the presence of the corrosive species.

Abstract: In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die containing a light-emitting diode is positioned above a substrate. During operation, both the combination of at least one conductive plate adjacent to the die and a plurality of castellated side holes positioned on sides of the substrate, and a substrate thermal via positioned beneath the die, conduct thermal energy from the die to a light-emitting diode assembly pad on which the substrate is mounted. The light-emitting diode assembly pad conducts thermal energy to a top pad of the spacer assembly. A plurality of castellated side holes formed in sides of a spacer of the spacer assembly and a plurality of thermal vias positioned within the spacer conduct thermal energy from the top pad of the spacer assembly to a base pad of the spacer assembly.

Abstract: An electronic module assembly including a first substrate; a first semiconductor die mounted to a top surface of the first substrate; a second substrate located above the first semiconductor die and electrically and mechanically connected to the top surface of the first substrate; a second semiconductor die mounted to a top surface of the second substrate; a heat spreader located above the second semiconductor die and thermally coupled to the second semiconductor die; and encapsulant material at least partially surrounding the second semiconductor die and the heat spreader.

Abstract: In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die containing a light-emitting diode is positioned above a substrate. During operation, both the combination of at least one conductive plate adjacent to the die and a plurality of castellated side holes positioned on sides of the substrate, and a substrate thermal via positioned beneath the die, conduct thermal energy from the die to a light-emitting diode assembly pad on which the substrate is mounted. The light-emitting diode assembly pad conducts thermal energy to a top pad of the spacer assembly. A plurality of castellated side holes formed in sides of a spacer of the spacer assembly and a plurality of thermal vias positioned within the spacer conduct thermal energy from the top pad of the spacer assembly to a base pad of the spacer assembly.

Abstract: An IC package dissipates thermal energy using thermally and electrically conductive thermal fingers. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal fingers encompass the die pad area to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

Abstract: An IC package dissipates thermal energy using thermal bars. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal bars radiate outwardly from the die pad area and extend to the edge of the substrate component to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

Abstract: A semiconductor package has a die connected to a substrate with a transfer molding applied over the die. The transfer molding includes an electrically conductive material for forming an electromagnetic compatibility shield as an integral part thereof.