Abstract: A method for monitoring the status of a memory device is disclosed. The method includes, during operation of the memory device, exercising a first portion of the memory device more than at least one other portion of the memory device in order to induce an accelerated rate of aging of the first portion. The first portion is monitored to detect at least a potential for a failure in the first portion. According to the method, in response to monitoring the first portion, at least one corrective action is performed. Apparatus and computer readable media are also disclosed.

Abstract: A method for monitoring the status of a memory device is disclosed. The method includes, during operation of the memory device, exercising a first portion of the memory device more than at least one other portion of the memory device in order to induce an accelerated rate of aging of the first portion. The first portion is monitored to detect at least a potential for a failure in the first portion. According to the method, in response to monitoring the first portion, at least one corrective action is performed. Apparatus and computer readable media are also disclosed.

Abstract: An IC package dissipates thermal energy using thermally and electrically conductive thermal fingers. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal fingers encompass the die pad area to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

Abstract: An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

Abstract: An IC package dissipates thermal energy using thermal bars. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal bars radiate outwardly from the die pad area and extend to the edge of the substrate component to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

Abstract: An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.