Abstract: A probe apparatus having probe groups comprising two or three probes that independently contact single terminals of tested chips. As a result, the probe apparatus is capable of recognizing voltage drops of a test signal applied prior to the chip testing onto a test path along two or three probes contacting, the terminal and the interfaces between them. The test path does not pass through the chip. An electronic circuit measures the voltage drops and compensated accordingly operational signals passing through the terminals, the probes and the interfaces during the chip testing. A first embodiment comprises two probes per group. A second embodiment comprises three probes per group. In the second embodiment, the variable resistance component of three resistance measurements of first/second, first/third and second/third resistance paths are compared by the electronic circuit, in order to determine absolute resistance values for each of the three signal paths.

Abstract: An apparatus for electronically testing of bound electrical circuits connected to planar arrayed pads having removable mounted conductive beam probes to simplify the manufacturing and maintaining process. A space transformer comprises from outside electrically accessible conductive holes wherein the guided beam probes are friction resilient resting. In a second embodiment, the friction resilient resting induces a predetermined bending onto the beam probes. This is accomplished by offsetting guiding plates thus imposing a rotational urging on the probe neck within the conductive hole which is just a bare extension of the beam probe.

Abstract: A space transformer made up of a primary structure that is fabricated from semiconductor body for retaining beam probes used for contacting the pads of a circuit or device under test. The primary structure is part of the space transformer and has vias that hold the beam probes, and a ceramic support structure to provide sufficient stiffness before bonding it to a secondary structure of the space transformer. The fabrication of the primary structure and its embedding within the secondary structure is performed in a manner analogous to the fabrication of circuit chips and its embedding within the packaging. As a result, down scaling in chip fabrication can be correspondingly applied to the fabrication of space transformers.

Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length.

Abstract: This disclosure proposes an assembly structure for building probe cards to test square integrated circuit chips. The test probe card assembly structure has one or more wings located at 90° angles to each other upon which probes are laid in a parallel manner for attachment to a probe card. This allows 10 construction of the probe card so that probes touch contacts directly. The probe tips do not touch the contacts at an angle &thgr;, called the fan out angle. The probes also do not differ in their inclination angles &bgr;. As a result, the force at which the many probe tips touch the contacts is relatively constant throughout. In addition, the probe tips are less likely to scrub past the surface of the contact onto the insulation surface of the chip and in doing so damage it. The test probe card assembly structure also contains an epoxy groove, which controls epoxy flow so that the position of the probes stays aligned in the correct plane. The epoxy groove also prevents variance in beam length.

Abstract: A probe card for testing integrated circuits which maintains rigidity and probe alignment at elevated temperatures. The probe card has a number of probes radially oriented on an insulating plate with a nonuniform radial distribution. The probes extend through an insulating ring. The nonuniform radial distribution of probes has gaps which allows for bolt or attachment to attach a rigid plate to the insulating ring. The insulating plate can be made of printed circuit board material, the insulating ring can be made of epoxy. The rigid plate can be made of stainless steel or any other material that maintains rigidity at elevated temperatures. Preferably, the insulating plate also has a stiffener ring located opposite the insulating ring on the top side. The bolts extend through the stiffener ring. The insulating plate has vias which allow the probes to be electrically connected to test electronics located above a top side of the insulating plate.

Abstract: This disclosure proposes an assembly structure for building probe cards to test square integrated circuit chips. The test probe card assembly structure has one or more wings located at 90.degree. angles to each other upon which probes are laid in a parallel manner for attachment to a probe card. This allows construction of the probe card so that probes touch contacts directly. The probe tips do not touch the contacts at an angle .theta., called the fan out angle. The probes also do not differ in their inclination angles .beta.. As a result, the force at which the many probe tips touch the contacts is relatively constant throughout. In addition, the probe tips are less likely to scrub past the surface of the contact onto the insulation surface of the chip and in doing so damage it. The test probe card assembly structure also contains an epoxy groove, which controls epoxy flow so that the position of the probes stays aligned in the correct plane. The epoxy groove also prevents variance in beam length.

Abstract: An assembly for making electrical connections to unpackaged integrated circuits using dual contact probes. The probes are said to be dual contact because they contact both the integrated device under test and the testing circuit. The probes have two tips. One tip is located at the end of each leg of the "U"-shaped probe. In operation, the probes are oriented with the legs of the probes extending horizontally and the tips pointing up and down, contacting the IC under test and the testing circuit. The probes are each made of a single piece of metal, and so provide an electrical connection between the IC and testing circuit. Flexing in the legs provides springiness for assuring good contact. The probes are mounted on a rigid block that is rigidly connected to the testing circuit and IC under test. Alignment plates are used to accurately position the probes. The plates can be horizontal or vertical and they have holes or slots that engage parts of the probes.

Abstract: This invention presents a method for aligning a set of probes in a circuit testing apparatus with a set of pads of a circuit under test and the apparatus designed according to this method. The alignment includes the steps of selecting a first group G1 of probes from the set, such that all probes in group G1 have the same tip length L1 and the same beam length L2, and mounting each probe of group G1 on a first mounting block which has a first through-hole for each probe and a first removable portion which includes the first through-hole. During the mounting step the tip portion is placed in the through-hole, the mounting portion is attached to the first mounting block and the first removable portion is discarded. Then, a second mounting block is placed on the first mounting block and a second group G2 of probes selected from the set is mounted it in the same manner as group G1 on the first block.

Abstract: A method and device for accurately mounting a probe in a probe card and for maintaining correct location of the probe tip as the probe is used for electronic testing of an IC pad. A membrane having a slot is attached to a support structure of a probe card. The probe tip is inserted into the slot and the probe is affixed to the membrane at the edges of the slot using silicon rubber. The probe is then mounted in the support structure which has a groove for receiving the probe. A distal end of the probe is bonded to the walls of the groove so that the probe is free to move vertically in the groove, but constrained from moving laterally to prevent side-buckling. The membrane and silicon rubber hold the probe tip in proper location during thermal treating of the probe card assembly. Once mounted in the probe card by this method, the probe and probe tip will maintain proper location as they are used for electronic testing of an IC pad.

Abstract: The invention presents a method and a correspondingly designed probe for achieving uniform stress distribution when experiencing deflection. The probe has a top edge, a bottom edge, a tip, and a beam portion defined by selecting an inflection point along the top edge, such that the beam portion is contained between the tip and the inflection point, and the bottom edge below the beam portion is approximately straight, while the curvature of the top edge of the beam portion is fitted to a parabola. The tip has an outer edge, an inner edge, and a point of contact at the location where the outer and inner edges join. The inner edge is approximately straight while the curvature of the outer edge is fitted to a second parabola. The probe is preferably mounted in a support structure having a groove for receiving the probe such that the beam portion is free to move vertically in the groove and constrained laterally to prevent side-buckling.

Abstract: This invention presents a method and a mechanism for contacting a set of vertical probes of a circuit testing mechanism with a set of pads or bumps of a circuit under test. The vertical probes have a circular cross section, a tip portion of length L1 and a beam portion of length L2, such that the beam portion extends at a right angle to the tip portion. The tip portion is guided through a guide hole to the pads of the circuit under test and the beam portion secured by its end. In this geometry the contact force between the probe and the pad is described by the relation: ##EQU1## where D.sub.v is a vertical deflection of the probe, I is an area moment of inertia of the probe about its axis, and E is a Young's modulus of the probe. The tip length L1 and beam length L2 are selected for each of the vertical probes in such a way the contact force F in this relation is kept constant thus ensuring that the contact force F between the vertical probes and pads remains substantially equal.

Abstract: An embodiment of the present invention is a probe membrane with a center contact bump area and a plurality of signal connection sections separated by triangular reliefs in the membrane and terminating in a tangential row of contacts for wire bonding to a probe card. The system of triangular reliefs in the membrane allows the membrane to be puckered up such that the center contact bump area is raised approximately ninety mils above the general plane of the probe card. When the membrane has been fixed in its puckered up position, the triangular reliefs in the membrane form several radial rectangular slits. A translator gimbal attached to the center of the membrane provides stability and contact force for the contact bumps to a DUT. Areas of transparency in the vicinity of the contact bump area allows a user to view the I/O pads of a DUT for alignment with the contact bumps in the membrane.