Abstract: A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The packgage allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies.

Abstract: An inventive system and method for continually advancing film through an air-bearing film flattening system having at least one scanning area through which the air-flattened film may be scanned. The film is provided to an air-bearing mechanism comprising two opposing air-bearing plates which create opposing air cushions for maintaining the planarity of the film. The scanning area may comprise at least one optical aperture in the air-bearing plate or plates through which the scanner views the film, or a "viewing" area occupied by bundled coherent optical fibers which sequentially pick up image information from aligned regions of the image. The system provides for time efficient, clean, and error-free reading of the scanned image.

Abstract: A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies.

Abstract: A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies.

Abstract: An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The system includes a quarter wave plate positioned to suppress stray reflection from the projection lens. The system also includes a second quarter wave plate disposed on the screen and a polarizing film disposed on the second quarter wave plate to suppress ambient light from illuminating the screen and entering the system.

Abstract: An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. In particular, the present invention includes a color splitting prism assembly having a plurality of output faces through which a separate color component is directed to be reflected by a respective light valve. Color absorbing filters are disposed at each of the output faces to absorb the color components not corresponding to the color directed through each output face.

Abstract: An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The illumination system includes a light tunnel having a cross-sectional shape corresponding to the geometrical shape of the spacial light modulator to optimize the amount of light projected onto the screen.

Abstract: A jig for positioning an image mask and image receiving medium which includes a housing having a central bore, first means within the bore for supporting a mask or image receiving medium, a flexible diaphragm, second means for drawing vacuum, and a third means for applying superatmospheric pressure on one side of the diaphragm to deform it towards the first means to ensure proper positioning of the mask and image receiving medium. Also, the process for positioning the mask and image receiving medium is provided.