Abstract: A method for providing an improved white light source into a Bright Field-Dark Field three-dimensional metrology system for semiconductor wafers. It involves taking a laser light from a blue light laser and processing it through a consecutive series of optical elements to change the light to an encoded, structured white light with a shape that more closely resembles the geometric configuration of a BF-DF sensor having a linear design. The white light provided is much more efficient, has an increased photon density and a component of angled light in one axis, each which greatly enhances examination of surface defects on Si wafers/semiconductors.

Abstract: A novel BF-DF metrology that employs simultaneous, coordinated motion of the modulator wheel about its A axis, the BF-DF camera shuttering, the metrology chuck rotational (theta) motion about the C axis, and the metrology stage movement in the X, Y or both axes. This coordinated motion allows for a common frame of reference for the point cloud data to be established, wherein each individual data point is assigned a positional coordinate within a positional reference system (X, Y, C). This system allows for repeated scans with the same results, minimalized stitching, higher scanning speed, better resolution and faster back-end data processing, as the precise location of each data point or pixel in the point cloud of pixelated data generated by the BF-DF cameras, is known and can be dimensionally linked to every other data point.

Abstract: An improved Bright Field-Dark Field three-dimensional metrology system for semiconductor wafers, that encompasses an apparatus and method of providing a bright, white encoded light to a target that provides faster, superior surface defect detection with a higher resolution. It utilizes an illumination light that has its shape altered to closer approximate the shape of the line sensors that receive the reflected and refracted structured light from the illuminated target. The illuminating light is altered such that it is converging in one axis and convergent in the other axis with the angled light enabling better resolution of the defect areas investigated.

Abstract: An improved Bright Field-Dark Field three-dimensional metrology system for semiconductor wafers, that encompasses an apparatus and method of providing a bright, white encoded light to a target that provides faster, superior surface defect detection with a higher resolution. It utilizes an illumination light that has its shape altered to closer approximate the shape of the line sensors that receive the reflected and refracted structured light from the illuminated target. The illuminating light is altered such that it is converging in one axis and convergent in the other axis with the angled light enabling better resolution of the defect areas investigated.