Patents by Inventor Jared STEED

Jared STEED has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260258288
    Abstract: The present disclosure relates to a SFLA composition comprising the reaction product of precursors, the precursors comprise (i) a crystallizable polyol having: (1) a melting point of at least about 30° C.; and (2) an OH number of at least about 10 mg KOH/g, and (ii) less than 10 wt % of a tackifier having a melting point or softening point of at least about 40° C. A viscosity of the adhesive comprises at least one of: (1) less than about 10,000 cP at 60° C., (2) less than about 5,000 cP at 75° C. and (3) combinations thereof. Applications for the SFLA include the making of flexible packaging, wall coverings and other uses that include the lamination or bonding of one or more porous substrates.
    Type: Application
    Filed: January 17, 2024
    Publication date: September 3, 2026
    Inventors: Byoungchul LEE, Jared STEED, Randy JOHNSON
  • Publication number: 20260226328
    Abstract: A laminating adhesive composition for flexible food packaging using an isocyanate terminated compound which is a reaction product of (a) at least one polymeric isocyanate compound optionally having a 4,4?-MDI monomer content of no more than 65 wt %, and (b) a first polyol selected from the group consisting of polyether polyols, polyester polyols and combinations thereof; and (ii) at least one second polyol selected from the group consisting of polyether polyol, polyester polyol and combinations thereof. The polymeric isocyanate compound may have an NCO content from about 10 wt % to about 35 wt % and a viscosity from about 50 mPa·s to about 1000 mPa·s. A method of bonding a laminate with the adhesive composition, and a method of preparing the composition thereof. Preferably the adhesive composition exhibits a PAA migration of no more than 0.6 ppb with at least 7 days of cure.
    Type: Application
    Filed: January 22, 2024
    Publication date: August 6, 2026
    Inventors: Randy JOHNSON, Peiwang ZHU, Byoungchul LEE, Biswajit GHOSH, Jared STEED