Abstract: A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.

Abstract: A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.

Abstract: A method of removing material from a surface, which includes the steps of providing a base layer, at least one layer attached to the base layer, an intermediate finish surface, and a bonding interface surface. The intermediate finish surface is formed by removing the at least one layer and a portion of the base layer during a material removal process. The bonding interface surface is formed by a polishing process applied to the intermediate finish surface. There is an oxidation layer which is part of the base layer, as well as a mold release layer and a contamination layer, both of which are part of the at least one layer. The material removal process involves laser etching the at least one layer to create the intermediate finish surface, and the polishing process includes applying a second laser etching to the intermediate finish surface, forming the bonding interface surface.

Abstract: An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.

Abstract: An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.

Abstract: A method of removing material from a surface, which includes the steps of providing a base layer, at least one layer attached to the base layer, an intermediate finish surface, and a bonding interface surface. The intermediate finish surface is formed by removing the at least one layer and a portion of the base layer during a material removal process. The bonding interface surface is formed by a polishing process applied to the intermediate finish surface. There is an oxidation layer which is part of the base layer, as well as a mold release layer and a contamination layer, both of which are part of the at least one layer. The material removal process involves laser etching the at least one layer to create the intermediate finish surface, and the polishing process includes applying a second laser etching to the intermediate finish surface, forming the bonding interface surface.