Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Abstract: A surface mount device light emitting diode package is provided. The package includes a circuit board housing attached to a printed circuit board. The circuit board housing supports a first light emitting diode and a second light emitting diode. The light emitting diodes are then coupled to the printed circuit board.

Abstract: An apparatus and methods for attaching a component to a substrate, which allows through-hole mount electronic components to be attached to the substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending). The apparatus is, in general, a socket including a housing having a first surface, a second surface, and an attachment surface. A recess is defined within the housing, wherein the recess comprises a component chamber extending from the housing first surface to a horizontal portion of at least one lead guide channel that extends from the component chamber to the housing second surface. The lead guide channel includes a sloped wall extending from the component chamber toward the lead guide channel. A lid is attached to the housing and adapted to move from an open position to a closed position abutting the housing second surface.

Abstract: A surface mount device light emitting diode package is provided. The package includes a circuit board housing attached to a printed circuit board. The circuit board housing supports a first light emitting diode and a second light emitting diode. The light emitting diodes are then coupled to the printed circuit board.

Abstract: A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending), wherein the component retention socket itself facilitates safe and easy lead bending.