Patents by Inventor Jari Marjakangas

Jari Marjakangas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6511234
    Abstract: The invention relates to a signal transmission method and a motherboard structure used in a base station of a radio system, for example, and comprises printed circuit board units communicating with the motherboard structure and communicating with one another by signals. The motherboard structure comprises an optical fibre sheet having optical fibres arranged therein, first converter means receiving from the printed circuit board unit electrical low-power and high-frequency signals, such as clock signals and RF signals. The first converter means convert the received signals into optical signals, and each optical signal is conducted into an optical fibre of its own in the fibre sheet. The motherboard structure further comprises second converter means converting the optical signals which have propagated in the fibre sheet back into electrical signals which are conducted to the printed circuit board units after the conversion.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: January 28, 2003
    Assignee: Nokia Networks Oy
    Inventor: Jari Marjakangas
  • Patent number: 6184494
    Abstract: The present invention relates to a heating method and a printed circuit board comprising a heating element which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor between the heating element and the component to be heated, the heat conductor receiving heat generated by the heating element and conducting the heat along the surface of the printed circuit board beneath the lower surface of the component to be heated. Furthermore, the printed circuit board comprises conductor parts which are narrower that the heat conductor, or which have a smaller cross-sectional surface area than does the heat conductor, and which restrict heat transfer away from the heat conductor to a component other than the one to be heated when the heat conductor functions as a ground plane or a signal path.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: February 6, 2001
    Assignee: Nokia Networks OY
    Inventors: Arto Isokoski, Jari Marjakangas