Patents by Inventor Jarmo Konu

Jarmo Konu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitive grounding methods and apparatus for mobile devices
    Patent number: 9680212
    Abstract: Grounding apparatus for mobile devices and methods of utilizing and manufacturing the same. In one embodiment, an outer metallized surface of a mobile device is configured to capacitively couple a metal back cover to the device ground. Specifically, in one implementation, an exterior surface of the mobile device is metalized and coupled to the device ground via galvanic contacts. The exterior metalized surface is configured to be capacitively coupled a metal back cover of a mobile device to the device ground when the back cover is installed on the mobile device. By capacitively coupling the back cover to the device ground via the exterior metalized surface, the need to otherwise ground the back cover through the use of galvanic contacts is obviated, thereby reducing the number of components needed.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: June 13, 2017
    Assignee: Pulse Finland OY
    Inventors: Jarmo Konu, Prasadh Ramachandran, Petteri Annamaa
  • CAPACITIVE GROUNDING METHODS AND APPARATUS FOR MOBILE DEVICES
    Publication number: 20150138021
    Abstract: Grounding apparatus for mobile devices and methods of utilizing and manufacturing the same. In one embodiment, an outer metallized surface of a mobile device is configured to capacitively couple a metal back cover to the device ground. Specifically, in one implementation, an exterior surface of the mobile device is metalized and coupled to the device ground via galvanic contacts. The exterior metalized surface is configured to be capacitively coupled a metal back cover of a mobile device to the device ground when the back cover is installed on the mobile device. By capacitively coupling the back cover to the device ground via the exterior metalized surface, the need to otherwise ground the back cover through the use of galvanic contacts is obviated, thereby reducing the number of components needed.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 21, 2015
    Inventors: Jarmo Konu, Prasadh Ramachandran, Petteri Annamaa