Patents by Inventor Jaromir Va{hacek over (n)}hara

Jaromir Va{hacek over (n)}hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for sample orientation for TEM lamella preparation
    Patent number: 10504689
    Abstract: A substrate is alignable for ion beam milling or other inspection or processing by obtaining an electron channeling pattern (ECP) or other electron beam backscatter pattern from the substrate based on electron beam backscatter from the substrate. The ECP is a function of substrate crystal orientation and tilt angles associated with ECP pattern values at or near a maximum, minimum, or midpoint are used to determine substrate tilt. Such tilt is then compensated or eliminated using a tilt stage coupled the substrate, or by adjusting an ion beam axis. In typical examples, circuit substrate “chunks” are aligned for ion beam milling to reveal circuit features for evaluation of circuit processing.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: December 10, 2019
    Assignee: FEI Company
    Inventors: Tomá{hacek over (s)} Vystav{hacek over (e)}l, Libor Strako{hacek over (s)}, Anna Prokhodtseva, Jaromir Va{hacek over (n)}hara, Jaroslav Stárek