Abstract: A mounting assembly for a semiconductor device, particularly a power transistor, which encloses and holds the device upon a plate which serves as a heat sink securely on a printed circuit board has a cover enclosing the device and a spacer. Holes in the spacer, a flange on the device, the plate, the cover and the printed circuit board receive one or more bolts which independently and securely clamp the flange and heat sink plate between the spacer and the board and also independently clamp the cover to the board.

Abstract: An integrated circuit carrier is provided by a housing having an opening which receives a rectilinear integrated circuit package such as a dual in line package. The opening is defined by interior walls of the housing and a plate which extends along one of the walls and has spring means interconnecting the plate and the one wall. The plate and the wall opposite thereto, which defines the opening, may be angularly disposed with respect to each other such that the opening is tapered. The resilient mounting tends to clamp on and hold the integrated circuit package within the confines of the housing which may be made of conductive plastic material which makes contact with the leads of the integrated circuit and shields and protects the integrated circuit both electrically and mechanically.