Patents by Inventor Jarrid Wittkopf
Jarrid Wittkopf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11969945Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.Type: GrantFiled: June 18, 2019Date of Patent: April 30, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Patent number: 11887177Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, sensor output data for the part. A transmitter of the system transmits a re-order request for the part based on the sensor output data.Type: GrantFiled: June 18, 2019Date of Patent: January 30, 2024Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20230395549Abstract: In one example in accordance with the present disclosure, an integrated circuit device is described. The integrated circuit device includes an integrated circuit die that includes a first surface and a second surface. A first electrical contact is disposed on the first surface of the integrated circuit die and a second electrical contact is disposed on the second surface of the integrated circuit die.Type: ApplicationFiled: October 19, 2020Publication date: December 7, 2023Inventors: DAVID WAYNE GEORGE, KRISTOPHER J. ERICKSON, JARRID WITTKOPF
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Patent number: 11834739Abstract: Graphene printing is disclosed. A disclosed example graphene printing apparatus includes a gas source to cause a graphene precursor gas to flow across a surface of a substrate, and a localized heat source to locally heat portions of the surface to cause graphene to grow at the portions of the surface based on a printing pattern.Type: GrantFiled: June 13, 2018Date of Patent: December 5, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert Ionescu, Helen A Holder, Ning Ge, Jarrid Wittkopf
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Patent number: 11822995Abstract: In one example in accordance with the present disclosure, a system is described. The system includes at least one directional antenna to 1) emit energy waves towards a mass in which an object is disposed and 2) receive reflected signals from a resonator disposed on the object as the mass is moved relative to the directional antenna. The system also includes a controller to, based on received reflected signals, determine a pose of the object within the mass.Type: GrantFiled: April 12, 2019Date of Patent: November 21, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: M. Anthony Lewis, William J. Allen, Douglas Pederson, Jarrid Wittkopf, Kristopher J. Erickson, Robert Ionescu
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Publication number: 20230364859Abstract: An example of a kit for three-dimensional (3D) printing includes an ultraviolet (UV) light fusing agent and a detailing agent. The UV light fusing agent including an aqueous vehicle and a plasmonic metal nanoparticle that i) provides absorption enhancement at radiation wavelengths ranging from about 340 nm to about 450 nm, and ii) is present in an amount up to 2 wt% based on a total weight of the UV light fusing agent. The detailing agent includes a surfactant, a co-solvent, and water.Type: ApplicationFiled: October 29, 2020Publication date: November 16, 2023Inventors: EMRE HIRO DISCEKICI, KRZYSZTOF NAUKA, JARRID A WITTKOPF, KRISTOPHER J ERICKSON
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Publication number: 20230296547Abstract: In one example in accordance with the present disclosure, a three-dimensional (3D) printed sensor system is described. The 3D printed sensor system includes a 3D printed object. The 3D printed sensor system also includes a 3D printed sensor on a body of the 3D printed object. The 3D printed sensor includes a dielectric region disposed between electrodes. A capacitance of the dielectric region is indicative of an environmental condition of the 3D printed object. The 3D printed sensor system also includes a controller integrated with the body of the 3D printed object. The controller is to measure a capacitance of the 3D printed sensor.Type: ApplicationFiled: August 3, 2020Publication date: September 21, 2023Inventors: Jarrid Wittkopf, Eric Luna-Ramirez, Kristopher J. Erickson, James William Stasiak
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Publication number: 20230264415Abstract: Some examples include an additive manufacturing system including a processor and a memory to store instructions. The instructions cause the processor to generate print data from received data related to a three-dimensional build object. The generated print data includes defined print data to dispensing a first agent at a build area of a build material layer, defined print data to selectively dispensing a second agent at a component receiving area within the build area of the build material layer, the second agent to locally reduce a viscosity of the build material at the component receiving area to a viscous state, and defined print data to position a component within the component receiving area at a time of the component receiving area being in a viscous state.Type: ApplicationFiled: May 1, 2023Publication date: August 24, 2023Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kristopher ERICKSON, Jarrid WITTKOPF, Lihua ZHAO
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Patent number: 11685114Abstract: Some examples include an additive manufacturing system including a processor and a memory to store instructions. The instructions cause the processor to generate print data from received data related to a three-dimensional build object. The generated print data includes defined print data to dispensing a first agent at a build area of a build material layer, defined print data to selectively dispensing a second agent at a component receiving area within the build area of the build material layer, the second agent to locally reduce a viscosity of the build material at the component receiving area to a viscous state, and defined print data to position a component within the component receiving area at a time of the component receiving area being in a viscous state.Type: GrantFiled: January 15, 2019Date of Patent: June 27, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher Erickson, Jarrid Wittkopf, Lihua Zhao
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Publication number: 20230130339Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.Type: ApplicationFiled: April 20, 2020Publication date: April 27, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jarrid WITTKOPF, Kristopher J. ERICKSON, Eric LUNA-RAMIREZ, James W. STASIAK
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Patent number: 11423277Abstract: In some examples, a fluidic conductive trace based radio-frequency identification device may include a flexible substrate layer including a channel, and a trace formed of a conductive fluid that is disposed substantially within the channel. The fluidic conductive trace based radio-frequency identification device may further include a sealing layer disposed on the flexible substrate layer and the trace to seal the conductive fluid in a liquid state within the channel.Type: GrantFiled: February 7, 2017Date of Patent: August 23, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ning Ge, Jarrid Wittkopf, Robert Ionescu, Helen A. Holder, Paul Howard Mazurkiewicz
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Publication number: 20220234289Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form 1) a three-dimensional (3D) printed object and a container structure to form part of the 3D printed object. The container structure expels a payload when a predetermined condition is met. The additive manufacturing system also includes a payload distributor to place the payload in the container structure. A controller of the additive manufacturing system controls formation of the 3D printed object and the container structure.Type: ApplicationFiled: July 19, 2019Publication date: July 28, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: William J. Allen, Melanie Martin Citta, John C. Greeven, Kristopher J. Erickson, Jarrid Wittkopf, Temiloluwa Adegoke
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Publication number: 20220138374Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, a design file for the part. A modifier of the system receives user input modifying the design file and a transmitter transmits the modified design file for production of the part.Type: ApplicationFiled: June 18, 2019Publication date: May 5, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220134651Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a placement device to embed at least a portion of a container structure into the 3D printed object. The container structure expels a payload when a predetermined condition is met. A controller of the additive manufacturing system controls additive manufacturing and placement of the portion of the container structure.Type: ApplicationFiled: July 19, 2019Publication date: May 5, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: William J. Allen, Melanie Martin Citta, John C. Greeven, Kristopher J. Erickson, Jarrid Wittkopf, Temiloluwa Adegoke
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Publication number: 20220118707Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a scanner to read three-dimensional (3D) print information from a storage element to be embedded in a 3D printed object. The system also includes a controller. The controller 1) instructs an additive manufacturing device to form the 3D printed object based on the 3D print information stored in the storage element and 2) embeds the storage element into the 3D printed object.Type: ApplicationFiled: June 18, 2019Publication date: April 21, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Patent number: 11307683Abstract: In an example implementation, a touch-sensitive illuminating display includes a transparent flexible touch layer, a transparent top conductive layer adjacent the flexible touch layer, a bottom conductive layer, and an electroluminescent layer and variable-thickness dielectric layer sandwiched between the top and bottom conductive layers. Pressure against the flexible touch layer is to reduce the dielectric layer thickness and bring the top and bottom conductive layers closer together, causing the electroluminescent layer to emit light where the pressure is applied.Type: GrantFiled: January 31, 2017Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jarrid Wittkopf, Robert Ionescu, Ning Ge, Helen A Holder
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Patent number: 11309349Abstract: A device includes a P-N junction comprising a monolithic N-type semiconductor layer coupled to a monolithic P-type semiconductor layer. The monolithic N-type semiconductor layer includes a first portion and a second portion. The first portion has a first surface and the second portion has a second surface facing away from the first surface. The monolithic P-type semiconductor layer includes a third portion and a fourth portion. The third portion has a third surface and the fourth portion has a fourth surface facing away from the third surface.Type: GrantFiled: August 21, 2018Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ning Ge, Robert Ionescu, Helen A Holder, Jarrid Wittkopf
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Publication number: 20220097308Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device is to embed a storage element into the 3D printed object and a controller is to write data to the embedded storage element that relates to manufacturing conditions of the 3D printed object.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220097305Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
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Publication number: 20220097307Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device of the additive manufacturing system is to embed a sensing system into build material used to form the 3D printed object. The sensing system is to measure a manufacturing condition during formation of the 3D printed object. The additive manufacturing system also includes a controller to associate manufacturing condition with the 3D printed object.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen