Patents by Inventor Jarrod Vaillancourt

Jarrod Vaillancourt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230317692
    Abstract: Described herein is an apparatus and a method for thermal management. The apparatus includes an integrated circuit (IC) including at least one field effect transistor, wherein each at least one FET comprises a gate, a drain, and a source; and a diamond substrate bonded to the gate, the drain, and the source of each of the at least one FETs, wherein the diamond substrate includes at least one tuning element. The method includes forming at least one FET on an IC, wherein each at least one FET comprises a gate, a drain, and a source; and bonding a diamond substrate to the gate, the drain, and the source of each of the at least one FETs, wherein the diamond substrate includes at least one tuning element.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Raytheon Company
    Inventors: Jarrod Vaillancourt, Matthew C. Tyhach
  • Patent number: 11127652
    Abstract: A Monolithic Microwave Integrated Circuit (MMIC) structure having a thermally conductive substrate; a semiconductor layer disposed on a first portion of an upper surface of the substrate; an active mesa-shaped semiconductor device layer disposed on the semiconductor layer; and a passive electrical device disposed directly on a second portion of the upper surface of the substrate.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: September 21, 2021
    Assignee: Raytheon Company
    Inventors: Matthew C. Tyhach, Jarrod Vaillancourt
  • Publication number: 20210125893
    Abstract: A Monolithic Microwave Integrated Circuit (MMIC) structure having a thermally conductive substrate; a semiconductor layer disposed on a first portion of an upper surface of the substrate; an active mesa-shaped semiconductor device layer disposed on the semiconductor layer; and a passive electrical device disposed directly on a second portion of the upper surface of the substrate.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 29, 2021
    Applicant: Raytheon Company
    Inventors: Matthew C. Tyhach, Jarrod Vaillancourt
  • Publication number: 20160142654
    Abstract: Methods and systems for on-chip hyperspectral or multispectral imaging are disclosed, including providing an imaging system comprising one or more detectors; plasmonic hyperspectral or multispectral filters integrated onto each pixel of the IR FPA; and electrical interconnections to the IR FPA; and exposing the imaging system to electromagnetic radiation reflected from an area and using the imaging system to generate a hyperspectral image of the area. Other embodiments are described and claimed.
    Type: Application
    Filed: November 13, 2015
    Publication date: May 19, 2016
    Applicant: Applied NanoFemto Technolgies LLC
    Inventor: Jarrod Vaillancourt
  • Publication number: 20140175286
    Abstract: Methods and systems for electromagnetic detection are disclosed, including providing a high operating temperature quantum dot infrared photodetector comprising: a substrate; a bottom contacting layer atop the substrate; one or more active regions atop the bottom contacting layer; and a top contacting layer atop the one or more active regions; and exposing the high operating temperature quantum dot infrared photodetector to electromagnetic waves. Other embodiments are described and claimed.
    Type: Application
    Filed: December 23, 2013
    Publication date: June 26, 2014
    Inventor: Jarrod Vaillancourt
  • Publication number: 20140175287
    Abstract: Methods and systems for electromagnetic detection are disclosed, including providing an optical antenna enhanced detector comprising: a micro photodetector, wherein the micro photodetector comprises: a substrate; a bottom contacting layer atop the substrate; one or more active regions atop the bottom contacting layer; and a top contacting layer atop the one or more active regions; and an optical antenna integrated with the micro photodetector, wherein the optical antenna is configured to concentrate incident electromagnetic waves onto the micro photodetector; and exposing the optical antenna enhanced detector to electromagnetic waves. Other embodiments are described and claimed.
    Type: Application
    Filed: December 23, 2013
    Publication date: June 26, 2014
    Inventor: Jarrod Vaillancourt