Abstract: Methods and systems for investment casting with high performance aluminum alloys are described. High performance aluminum alloys can be modified with nanoparticles to be compatible with investment casting processes.

Abstract: Methods and systems for high pressure die casting with metal alloys of low silicon content are described. Metal alloys can be modified with nanoparticles to achieve high fluidity and hot cracking resistance to be compatible with high pressure die casting. The die cast metal parts have high strength, high ductility, and high thermal and electrical conductivity. The die cast metal parts can be anodized with different colors.

Abstract: Methods and systems for high pressure die casting with metal alloys of low silicon content are described. Metal alloys can be modified with nanoparticles to achieve high fluidity and hot cracking resistance to be compatible with high pressure die casting. The die cast metal parts have high strength, high ductility, and high thermal and electrical conductivity. The die cast metal parts can be anodized with different colors.

Abstract: An evaluation system including a hardware system for collecting real-time data for evaluating sleeping comfort performance of a bedding system is disclosed. The hardware system includes a thermal and moisture comfort measurement system, a thermal and moisture comfort control system, a biomechanical comfort control system, and a biomechanical comfort measurement system. The evaluation system also includes a computational system having a processor and a tactile database, and a portable device. The computational system is configured to receive and process the real-time data from the hardware system, and is communicatively connected to the portable device for transmitting real-time data for evaluating the bedding system and adjusting the hardware system.

Abstract: A biomedical device includes a zinc-based material including a matrix including zinc, and nanostructures dispersed in the matrix. Embodiments of this disclosure are directed to zinc (Zn)-based materials including dispersed nanostructures for biomedical applications and devices, such as bioresorbable vascular stents, bioresorbable ureteral stents, endoluminal springs for distraction enterogenesis, biodegradable bone implants with tunable modulus, guided bone generation membranes, bioresorbable dental membranes, and other biomedical implants, as well as other functional applications, such as biodegradable electronics and sensors.

Abstract: An LED light source is described herein, which comprises: a hollow heat sink having a top wall, a bottom opening, and a sidewall, the top wall including an upper surface and a lower surface, the upper surface having a central area and a peripheral area, and the top wall having at least one first hole in the peripheral area; an interposer being overmolded on the peripheral area and the lower surface, and extending through the at least one first hole; an LED package comprising at least one LED chip and mounted in the central area; an LED driver located within the hollow heat sink and positioned on a side of the interposer facing the bottom opening.

Abstract: An evaluation system including a hardware system for collecting real-time data for evaluating sleeping comfort performance of a bedding system is disclosed. The hardware system includes a thermal and moisture comfort measurement system, a thermal and moisture comfort control system, a biomechanical comfort control system, and a biomechanical comfort measurement system. The evaluation system also includes a computational system having a processor and a tactile database, and a portable device. The computational system is configured to receive and process the real-time data from the hardware system, and is communicatively connected to the portable device for transmitting real-time data for evaluating the bedding system and adjusting the hardware system.

Abstract: An LED light source is described herein, which comprises: a hollow heat sink having a top wall, a bottom opening, and a sidewall, the top wall including an upper surface and a lower surface, the upper surface having a central area and a peripheral area, and the top wall having at least one first hole in the peripheral area; an interposer being overmolded on the peripheral area and the lower surface, and extending through the at least one first hole; an LED package comprising at least one LED chip and mounted in the central area; an LED driver located within the hollow heat sink and positioned on a side of the interposer facing the bottom opening.