Abstract: The present disclosure relates to a device having a first wall that includes a first opening having a first edge, and a first aperture through the first wall. The first edge may be positioned at least partially within a first plane, the first wall and the first plane may define a first space positioned within the first wall, and the first aperture may have a second edge with at least a portion of the second edge positioned outside of the first plane. The device may be utilized to shield one or more sensors from radiation, to insure measurements made by the one or more sensors more accurately represent the actual environmental conditions.

Abstract: An aspect of the present disclosure is a thermal barrier that includes a core layer having a first surface, a second surface, and a first edge, and a first outer layer that includes a third surface and a second edge, where the third surface substantially contacts the first surface, the core layer is configured to minimize conductive heat transfer through the barrier, and the first outer layer is configured to maximize reflection of light away from the barrier.

Abstract: The present disclosure relates to a device having a first wall that includes a first opening having a first edge, and a first aperture through the first wall. The first edge may be positioned at least partially within a first plane, the first wall and the first plane may define a first space positioned within the first wall, and the first aperture may have a second edge with at least a portion of the second edge positioned outside of the first plane. The device may be utilized to shield one or more sensors from radiation, to insure measurements made by the one or more sensors more accurately represent the actual environmental conditions.

Abstract: An aspect of the present disclosure is a thermal barrier that includes a core layer having a first surface, a second surface, and a first edge, and a first outer layer that includes a third surface and a second edge, where the third surface substantially contacts the first surface, the core layer is configured to minimize conductive heat transfer through the barrier, and the first outer layer is configured to maximize reflection of light away from the barrier.

Abstract: Systems and methods for providing conditioning to a space within an environment are provided. Such a system may include a solid boundary, at least one air supply aperture configured to direct a conditioned airflow towards the solid boundary, and at least one air return aperture configured to receive a return airflow. At least one of the conditioned airflow or the return airflow may create an air boundary, such that the air boundary and the solid boundary define the space within the environment. At least a portion of the conditioned airflow may enter the space, and at least a portion of the return airflow may exit the space, thereby conditioning the space.

Abstract: Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.

Abstract: Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.