Patents by Inventor Jason A. Reese

Jason A. Reese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12290826
    Abstract: The present disclosure provides for an automated spray system (100) to produce an elastomeric pad on a railroad tie. The automated spray system (100) includes a two-component spray system (102) for spraying a two-component reaction mixture to produce the elastomeric pad on the railroad tie. The automated spray system further includes a gantry system (140) having girder (146) that supports the spray applicator.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: May 6, 2025
    Assignee: Dow Global Technologies LLC
    Inventors: Yinglong Chen, Larry D. Dotson, Huang Wu, Jason A Reese, Kevin W. Light, Annette Baker, J. Cody Clinton
  • Patent number: 11718934
    Abstract: A method of preparing a resin infused random fiber mat including the step of forming a liquid dispersion mat of polymeric resin and fiber on a porous substrate.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: August 8, 2023
    Assignee: Dow Global Technologies LLC
    Inventors: Craig F. Gorin, Manesh Nadupparambil Sekharan, Jason A. Reese, Amit K. Chaudhary, Daniel L. Dermody, Kevin J. Bouck, Rebekah K. Feist, Thomas J. Parsons, David H. Bank
  • Publication number: 20230228040
    Abstract: The present invention provides multi-layer articles for use as a rail tie footings comprising, as the tie, an elongate rigid body having a substantially planar surface, and on the substantially planar surface comprising a a microcellular foam elastomeric pad, for example, of a substantially organic solvent free polyurethane, wherein the substantially planar surface has a peripheral landing on which there is no elastomeric pad and the elastomeric pad has a bulk density (ASTM D3676) of from 600 to 2000 Kg/m3 (0.6 to 2.0 g/cm3).
    Type: Application
    Filed: August 30, 2021
    Publication date: July 20, 2023
    Inventors: Yinglong Chen, Larry Dotson, Huang Wu, Jason A. Reese, Kevin W. Light, Larry W. Mobley, Maria Jose Cotanda Santapau
  • Publication number: 20230034329
    Abstract: The present disclosure provides for an automated spray system (100) to produce an elastomeric pad on a railroad tie. The automated spray system (100) includes a two-component spray system (102) for spraying a two-component reaction mixture to produce the elastomeric pad on the railroad tie. The automated spray system further includes a gantry system (140) having girder (146) that supports the spray applicator.
    Type: Application
    Filed: January 7, 2021
    Publication date: February 2, 2023
    Applicant: Dow Global Technologies LLC
    Inventors: Yinglong Chen, Larry D. Dotson, Huang Wu, Jason A. Reese, Kevin W. Light, Annette Baker, J. Cody Clinton
  • Patent number: 11286358
    Abstract: A molding compound is made by heat-softening, fusing and compressing strips of unidirectionally aligned filaments embedded in a thermosetting resin. The thermosetting resin is non-tacky at room temperature, which allows for easy handling, elimination of cold storage and the use of robotic manufacturing methods. Composites made by molding the molding compound have excellent, highly isotropic tensile properties.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: March 29, 2022
    Assignee: Dow Global Technologies LLC
    Inventors: Jason A. Reese, Richard Baumer, David H. Bank, Amit K. Chaudhary
  • Publication number: 20210301074
    Abstract: An epoxy resin composition useful for making a molded composite article including: (a) at least one epoxy resin compound, (b) at least one curing agent, (c) at least one curing accelerator, (d) at least one internal mold release agent; and (e) at least one reaction inhibitor; and a molded composite article made from the above epoxy resin composition.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 30, 2021
    Inventors: Amit K. Chaudhary, Jason A. Reese, Bharati Balijepalli
  • Publication number: 20210115202
    Abstract: A method of preparing a resin infused random fiber mat including the step of forming a liquid dispersion mat of polymeric resin and fiber on a porous substrate.
    Type: Application
    Filed: February 14, 2018
    Publication date: April 22, 2021
    Inventors: Craig F. Gorin, Manesh Nadupparambil Sekharan, Jason A. Reese, Amit K. Chaudhary, Daniel L. Dermody, Kevin J. Bouck, Rebekah K. Feist, Thomas J. Parsons, David H. Bank
  • Publication number: 20180355134
    Abstract: A molding compound is made by heat-softening, fusing and compressing strips of unidirectionally aligned filaments embedded in a thermosetting resin. The thermosetting resin is non-tacky at room temperature, which allows for easy handling, elimination of cold storage and the use of robotic manufacturing methods. Composites made by molding the molding compound have excellent, highly isotropic tensile properties.
    Type: Application
    Filed: March 21, 2018
    Publication date: December 13, 2018
    Applicant: Dow Global Technologies LLC
    Inventors: Jason A. Reese, Richard Baumer, David H. Bank, Amit K. Chaudhary
  • Publication number: 20170099029
    Abstract: The present invention is premised upon an improved photovoltaic device (“PV device”) more particularly to an improved photovoltaic device with a multilayered photovoltaic cell assembly and a body portion joined at an interface region and including an intermediate layer, at least one interconnecting structural member, relieving feature, unique component geometry or any combination thereof.
    Type: Application
    Filed: November 29, 2016
    Publication date: April 6, 2017
    Inventors: Jason A. Reese, James R. Keenihan, Ryan S. Gaston, Keith L. Kauffmann, Joseph A. Langmaid, Leonardo C. Lopez, Kevin D. Maak, Michael E. Mills, Narayan Ramesh, Samar R. Teli
  • Patent number: 9602046
    Abstract: The present invention is premised upon an improved photovoltaic device (“PV device”), more particularly to an improved photovoltaic device with a multilayered photovoltaic cell assembly and a body portion joined at an interface region and including an intermediate layer, at least one interconnecting structural member, relieving feature, unique component geometry, or any combination thereof.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: March 21, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Jason A Reese, James R Keenihan, Ryan S Gaston, Keith L Kauffmann, Joseph A Langmaid, Leonardo C Lopez, Kevin D Maak, Michael E Mills, Narayan Ramesh, Samar R Teli
  • Patent number: 9398712
    Abstract: The present invention is premised upon a connector and electronic circuit assembly (130) at least partially encased in a polymeric frame (200). The assembly including at least: a connector housing (230); at least one electrical connector (330); at least one electronic circuit component (430); and at least one barrier element (530).
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: July 19, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Jason A. Reese, Samar R. Teli, James R. Keenihan, Joseph A. Langmaid, Kevin D. Maak, Michael E. Mills, Timothy C. Plum, Narayan Ramesh
  • Publication number: 20150263665
    Abstract: The present invention is premised upon an improved photovoltaic device (“PV device”), more particularly to an improved photovoltaic device with a multilayered photovoltaic cell assembly and a body portion joined at an interface region and including an intermediate layer, at least one interconnecting structural member, relieving feature, unique component geometry, or any combination thereof.
    Type: Application
    Filed: June 1, 2015
    Publication date: September 17, 2015
    Inventors: Jason A. Reese, James R. Keenihan, Ryan S. Gaston, Keith L. Kauffmann, Joseph A. Langmaid, Leonardo C. Lopez, Kevin D. Maak, Michael E. Mills, Narayan Ramesh, Samar R. Teli
  • Patent number: 9123847
    Abstract: The present invention is premised upon an improved photovoltaic device (“PV device”), more particularly to an improved photovoltaic device (10) with a multilayered photovoltaic cell assembly (100) and a body portion (200) joined at an interface region (410) and including an intermediate layer (500), at least one interconnecting structural member (1500), relieving feature (2500), unique component geometry, or any combination thereof.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: September 1, 2015
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Jason A. Reese, James R. Keenihan, Ryan S. Gaston, Keith L. Kauffmann, Joseph A. Langmaid, Leonardo C. Lopez, Kevin D. Maak, Michael E. Mills, Narayan Ramesh, Samar R. Teli
  • Patent number: 9076657
    Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
    Type: Grant
    Filed: June 22, 2013
    Date of Patent: July 7, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, Jason A. Reese, George R. Allardyce
  • Patent number: 9048358
    Abstract: The present invention is premised upon an improved photovoltaic device (“PV device”), more particularly to an improved photovoltaic device with a multilayered photovoltaic cell assembly and a body portion joined at an interface region and including an intermediate layer, at least one interconnecting structural member, relieving feature, unique component geometry, or any combination thereof.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: June 2, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Jason A. Reese, James R. Keenihan, Ryan S. Gaston, Keith L. Kauffmann, Joseph A. Langmaid, Leonardo C. Lopez, Kevin D. Maak, Michael E. Mills, Narayan Ramesh, Samar R. Teli
  • Patent number: 8912426
    Abstract: The present invention is premised upon an improved photovoltaic device (“PV device”), more particularly to an improved photovoltaic device with a multilayered photovoltaic cell assembly and a body portion joined at an interface region.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: December 16, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Michael E. Mills, James R. Keenihan, Kevin D. Maak, Narayan Ramesh, Jason A. Reese, James C. Stevens, Samar R. Teli
  • Patent number: 8883934
    Abstract: Flexible polyurethane foams that function well in noise and vibration absorption applications are made from a mixture of polyether polyols oxides that each has a hydroxyl equivalent weight of from 1200 to 3000 and at least 70% primary hydroxyl groups. From 5 to 80% by weight of the ethylene oxide-capped polypropylene oxides are nominally difunctional, from 0.5 to 20% by weight of the ethylene oxide-capped polypropylene oxides have a nominal functionality of four or higher, and the balance of the ethylene oxide-capped polypropylene oxides, but not less than 1.5% by weight thereof, are nominally trifunctional.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: November 11, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Helmut Stegt, Allan James, Stephen R. Burks, Jason A. Reese, David J. Honkomp
  • Publication number: 20140174936
    Abstract: Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
    Type: Application
    Filed: April 19, 2012
    Publication date: June 26, 2014
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, Jason A. Reese, Lingyun Wei
  • Patent number: 8603314
    Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: December 10, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, Jason A. Reese, George R. Allardyce
  • Publication number: 20130264214
    Abstract: Metal electroplating processes are used in pH sensitive applications to plate metal layers on semiconductors. The semiconductors may be used in the manufacture of photovoltaic devices and solar cells.
    Type: Application
    Filed: April 4, 2012
    Publication date: October 10, 2013
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, David L. Jacques, Jason A. Reese