Abstract: In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: Embodiments herein provide a semiconductor substrate cleaning chamber. The cleaning chamber includes side walls that partially define a cleaning volume, a pedestal disposed within the side walls, and a cleaning arm disposed above the pedestal. The cleaning arm includes a nozzle assembly disposed on a nozzle end of the cleaning arm. The nozzle assembly includes a housing, and a body disposed within the housing and having a gas port disposed through the body and configured to aerate a fluid passing through the nozzle assembly.

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.

Abstract: Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture. The frames may include a plurality of fingers that are coupled with the frame body. Each of the plurality of fingers may extend into the central aperture. Each of the plurality of fingers may include a substrate receiving interface. At least one of the plurality of fingers may include an actuator that manipulates a respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.

Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.