Patents by Inventor Jason A. Rye
Jason A. Rye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230360940Abstract: Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture. The frames may include a plurality of fingers that are coupled with the frame body. Each of the plurality of fingers may extend into the central aperture. Each of the plurality of fingers may include a substrate receiving interface. At least one of the plurality of fingers may include an actuator that manipulates a respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.Type: ApplicationFiled: May 3, 2022Publication date: November 9, 2023Applicant: Applied Materials, Inc.Inventor: Jason A. Rye
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Publication number: 20230040192Abstract: Embodiments of wet clean chambers are provided herein. In some embodiments, a wet clean chamber includes: a deck plate; a substrate support that is rotatable and configured to support a substrate; a rotor disposed about and configured to rotate with the substrate support, wherein the rotor includes an upper fluid collection region disposed radially outward of the substrate support in position to collect fluid leaving the substrate support during processing, and wherein the upper fluid collection region includes a plurality of drain openings along a radially outward perimeter of a bottom of the upper fluid collection region; a stationary housing surrounding the rotor and having a lower fluid collection region disposed beneath the drain openings of the rotor; and one or more fluid delivery arms coupled to the deck plate and configured to deliver fluid to the substrate.Type: ApplicationFiled: August 3, 2022Publication date: February 9, 2023Inventors: Jason RYE, Nolan Layne ZIMMERMAN
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Patent number: 11241718Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.Type: GrantFiled: April 17, 2019Date of Patent: February 8, 2022Assignee: Applied Materials, Inc.Inventors: Joseph Antony Jonathan, Kyle M. Hanson, Jason A. Rye, James E. Brown, Gregory J. Wilson, Eric J. Bergman, Tricia A. Youngbull, Timothy G. Stolt
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Publication number: 20190321861Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.Type: ApplicationFiled: April 17, 2019Publication date: October 24, 2019Applicant: Applied Materials, Inc.Inventors: Joseph A. Jonathan, Kyle M. Hanson, Jason Rye, James Brown, Greg Wilson, Eric J. Bergman, Tricia A. Youngbull, Timothy Gale Stolt
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Patent number: 9864283Abstract: Apparatus for cleaning a photo mask includes a rotor in a head, with the rotor having a seal plate having a central opening, a resilient mask seal in the central opening, and retractors attached to the resilient mask seal and adapted to move the resilient mask seal into open and closed positions. A motor in the head rotates the rotor. A push plate in the head moves to operate the retractors. In the closed position the resilient mask seal seals against the sides of the photo mask. The back side of the photo mask can then be cleaned without affecting the patterned front side of the photo mask.Type: GrantFiled: November 18, 2015Date of Patent: January 9, 2018Assignee: Applied Materials, Inc.Inventors: Jason Rye, Kyle Moran Hanson
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Patent number: 9812344Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.Type: GrantFiled: February 3, 2015Date of Patent: November 7, 2017Assignee: Applied Materials, Inc.Inventors: Jason Rye, Mario David Silvetti, Randy A. Harris, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar
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Patent number: 9799537Abstract: A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.Type: GrantFiled: December 3, 2010Date of Patent: October 24, 2017Assignee: APPLIED Materials, Inc.Inventors: Jason Rye, Kyle M. Hanson
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Publication number: 20170139334Abstract: Apparatus for cleaning a photo mask includes a rotor in a head, with the rotor having a seal plate having a central opening, a resilient mask seal in the central opening, and retractors attached to the resilient mask seal and adapted to move the resilient mask seal into open and closed positions. A motor in the head rotates the rotor. A push plate in the head moves to operate the retractors. In the closed position the resilient mask seal seals against the sides of the photo mask. The back side of the photo mask can then be cleaned without affecting the patterned front side of the photo mask.Type: ApplicationFiled: November 18, 2015Publication date: May 18, 2017Inventors: Jason Rye, Kyle Moran Hanson
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Publication number: 20160225656Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.Type: ApplicationFiled: February 3, 2015Publication date: August 4, 2016Inventors: Jason Rye, Mario David Silvetti, Randy A. Harris, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar
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Patent number: 8541309Abstract: A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.Type: GrantFiled: December 3, 2010Date of Patent: September 24, 2013Assignee: APPLIED Materials, Inc.Inventors: Jason Rye, Kyle M. Hanson
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Publication number: 20120142196Abstract: A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.Type: ApplicationFiled: December 3, 2010Publication date: June 7, 2012Inventors: Jason Rye, Kyle M. Hanson
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Publication number: 20120138091Abstract: A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.Type: ApplicationFiled: December 3, 2010Publication date: June 7, 2012Inventors: Jason Rye, Kyle M. Hanson
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Patent number: 8104488Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.Type: GrantFiled: July 24, 2007Date of Patent: January 31, 2012Assignee: Applied Materials, Inc.Inventors: Jason A. Rye, Kyle M. Hanson, Daniel J. Woodruff
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Patent number: 8082932Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. The rotor may have cylindrical side walls joined to a top plate, and with the gas inlets located in the cylindrical sidewalls. The head is moveable into engagement with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece.Type: GrantFiled: February 22, 2006Date of Patent: December 27, 2011Assignee: Applied Materials, Inc.Inventors: Jason Rye, Daniel J. Woodruff
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Publication number: 20110217848Abstract: A processing chamber successfully removes hardened photoresist via direct infrared radiation onto the wafer, in the presence of an acid such as sulfuric acid, optionally along with an oxidizer such as hydrogen peroxide. The processing chamber includes a fixture for holding and optionally rotating the wafer. An infrared irradiating assembly has infrared lamps outside of the processing chamber positioned to radiate infrared light into the processing chamber. The infrared lamps may be arranged to irradiate substantially the entire surface of a wafer on the rotor. A cooling assembly can be associated with the infrared radiating assembly to provide a quick cool down and avoid over-processing. Photoresist is removed using small amounts of chemical solutions.Type: ApplicationFiled: March 3, 2010Publication date: September 8, 2011Inventors: Eric J. Bergman, Jerry Dustin Leonhard, Bryan Puch, Jason Rye
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Patent number: 7938942Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.Type: GrantFiled: February 26, 2007Date of Patent: May 10, 2011Assignee: Applied Materials, Inc.Inventors: Jason A. Rye, Kyle M. Hanson
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Publication number: 20080011334Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.Type: ApplicationFiled: July 24, 2007Publication date: January 17, 2008Inventors: Jason Rye, Kyle Hanson, Daniel Woodruff
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Publication number: 20070261726Abstract: A wafer processor has a process head engageable with a process chamber. A rotor on the process head has multiple wafer holding positions offset from the rotor axis. A wafer retaining device holds the wafers in place, in the holding positions, during processing. As the rotor spins, wafers retained in the wafer holding positions revolve around the axis. Multiple smaller size wafers may be simultaneously processed within a single processor.Type: ApplicationFiled: May 11, 2006Publication date: November 15, 2007Inventors: Jason Rye, Kyle Hanson
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Publication number: 20070193607Abstract: In methods and apparatus for cleaning a wafer, a cleaning liquid is sprayed or jetted in a direction generally tangent to the circular edge of a spinning wafer. This enhances removal of contaminants from areas near the edge. Re-deposition of contaminant pieces or particles back onto the wafer is reduced because the direction of the spray carries the contaminant off of the wafer. Insoluble contaminant films, such as post etch residue, may be removed via one or more of the pressure of the cleaning liquid, the effects of higher process temperatures from heating the cleaning liquid, and by the chemical composition of the cleaning liquid.Type: ApplicationFiled: April 24, 2007Publication date: August 23, 2007Inventors: John Ghekiere, Aaron Arvidson, Bruce Fender, Craig Meuchel, Raoul Schroder, Brian Aegerter, Ron Flink, Jason Rye
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Publication number: 20070137679Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.Type: ApplicationFiled: February 26, 2007Publication date: June 21, 2007Inventors: Jason Rye, Kyle Hanson