Patents by Inventor Jason Aggio

Jason Aggio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition and method for planarizing surfaces
    Patent number: 7955519
    Abstract: The invention provides compositions and methods for planarizing or polishing a surface. One composition comprises about 0.01 wt. % to about 20 wt. % ?-alumina particles, wherein the ?-alumina particles have an average diameter of 200 nm or less, and 80% of the ?-alumina particles have a diameter of about 500 nm or less, an organic acid, a corrosion inhibitor, and water. Another composition comprises ?-alumina particles, an organic acid, dual corrosion inhibitors of triazole and benzotriazole, wherein the wt. % ratio of the triazole to benzotriazole is about 0.1 to about 4.8, and water.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: June 7, 2011
    Assignee: Cabot Microelectronics Corporation
    Inventors: Yuchun Wang, Jason Aggio, Bin Lu, John Parker, Renjie Zhou
  • Compositions and methods for CMP of low-k-dielectric materials
    Patent number: 7456107
    Abstract: The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: November 25, 2008
    Assignee: Cabot Microelectronics Corporation
    Inventors: Jason Keleher, Daniel Woodland, Francesco De Rege Thesauro, Robert Medsker, Jason Aggio
  • Compositions and methods for CMP of low-k-dielectric materials
    Publication number: 20080111101
    Abstract: The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 15, 2008
    Inventors: Jason Keleher, Daniel Woodland, Francesco De Rege Thesauro, Robert Medsker, Jason Aggio
  • Composition and method for planarizing surfaces
    Publication number: 20070075040
    Abstract: The invention provides compositions and methods for planarizing or polishing a surface. One composition comprises about 0.01 wt. % to about 20 wt. % ?-alumina particles, wherein the ?-alumina particles have an average diameter of 200 nm or less, and 80% of the ?-alumina particles have a diameter of about 500 nm or less, an organic acid, a corrosion inhibitor, and water. Another composition comprises ?-alumina particles, an organic acid, dual corrosion inhibitors of triazole and benzotriazole, wherein the wt. % ratio of the triazole to benzotriazole is about 0.1 to about 4.8, and water.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Applicant: Cabot Microelectronics Corporation
    Inventors: Yuchun Wang, Jason Aggio, Bin Lu, John Parker, Renjie Zhou