Patents by Inventor Jason Allen Cramer

Jason Allen Cramer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged device adapter assembly with alignment structure and methods regarding same
    Patent number: 6877993
    Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: April 12, 2005
    Assignee: Ironwood Electronics, Inc.
    Inventors: Ilavarasan Palaniappa, Mickiel Fedde, Jason Allen Cramer
  • Packaged device adapter assembly with alignment structure and methods regarding same
    Publication number: 20040242030
    Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Applicant: Ironwood Electronics, Inc.
    Inventors: Ilavarasan Palaniappa, Mickiel Fedde, Jason Allen Cramer