Abstract: An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a grounding shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The grounding shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stack such that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.

Abstract: An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a grounding shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The grounding shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stack such that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.

Abstract: An electronic assembly includes a printed circuit board (PCB) and an electromagnetic interference (EMI) shield. The PCB includes a plurality of electronic components and a plurality of electrically-conductive traces. The EMI shield is sized and shaped to form a perimeter around at least one of the plurality of electronic components on the PCB. The plurality of electrically-conductive traces cross the perimeter formed by the EMI shield. The EMI shield includes a plurality of decoupling, filtering, or matching components electrically connected between the EMI shield and the plurality of electrically-conductive traces such that the plurality of decoupling, filtering, or matching components are configured to shunt signal noise from the plurality of electrically-conductive traces. The EMI shield is electrically connected to the PCB via the plurality of decoupling, filtering, or matching components to encapsulate and electromagnetically isolate the plurality of electronic components.

Abstract: The present disclosure relates to a printed circuit board (PCB) device and methods for fabricating a PCB device. In some aspects, the PCB device can comprise a surface or internal layer including one or more electrically conductive traces configured to carry a signal or power plane. The PCB device can also comprise at least one thin film comprising an electrically insulating material disposed on the surface or the internal layer. Additionally, the PCB device can comprise one or more electrically conductive layers on the at least one thin film. In some aspects, the one or more electrically conductive layers and the one or more electrically conductive traces can be separated by the at least one thin film in a configuration that defines a capacitive frequency response between the one or more electrically conductive layers and the one or more electrically conductive traces.