Patents by Inventor Jason Arjavac
Jason Arjavac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230197403Abstract: Methods and apparatus are disclosed for integration of image-based metrology into a milling workflow. A first ion beam milling operation is performed to an edge at a distance from a final target position on a sample. An SEM image of the sample is used to determine a distance between the milled edge and a reference structure on the sample. Based on the determined distance, the ion beam is adjusted to perform a second milling operation to shift the milled edge to the final target position. Extensions to iterative procedures are disclosed. Various geometric configurations and corrections are disclosed. Manufacturing and analytic applications are disclosed in a variety of fields, including read-write head manufacture and TEM sample preparation. Other combinations of imaging and milling tools can be used.Type: ApplicationFiled: July 26, 2022Publication date: June 22, 2023Applicant: FEI CompanyInventors: Thomas Gary Miller, Jason Arjavac, Brian Routh, JR., Mark Biedrzycki
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Patent number: 11313042Abstract: A method, system, and computer-readable medium for forming transmission electron microscopy sample lamellae using a focused ion beam including directing a high energy focused ion beam toward a bulk volume of material; milling away the unwanted volume of material to produce an unfinished sample lamella with one or more exposed faces having a damage layer; characterizing the removal rate of the focused ion beam; subsequent to characterizing the removal rate, directing a low energy focused ion beam toward the unfinished sample lamella for a predetermined milling time to deliver a specified dose of ions per area from the low energy focused ion beam; and milling the unfinished sample lamella with the low energy focused ion beam to remove at least a portion of the damage layer to produce the finished sample lamella including at least a portion of the feature of interest.Type: GrantFiled: September 10, 2019Date of Patent: April 26, 2022Assignee: FEI CompanyInventors: Thomas G. Miller, Jason Arjavac, Michael Moriarty
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Publication number: 20200095688Abstract: A method, system, and computer-readable medium for forming transmission electron microscopy sample lamellae using a focused ion beam including directing a high energy focused ion beam toward a bulk volume of material; milling away the unwanted volume of material to produce an unfinished sample lamella with one or more exposed faces having a damage layer; characterizing the removal rate of the focused ion beam; subsequent to characterizing the removal rate, directing a low energy focused ion beam toward the unfinished sample lamella for a predetermined milling time to deliver a specified dose of ions per area from the low energy focused ion beam; and milling the unfinished sample lamella with the low energy focused ion beam to remove at least a portion of the damage layer to produce the finished sample lamella including at least a portion of the feature of interest.Type: ApplicationFiled: September 10, 2019Publication date: March 26, 2020Applicant: FEI CompanyInventors: Thomas G. Miller, Jason Arjavac, Michael Moriarty
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Patent number: 10465293Abstract: A method, system, and computer-readable medium for forming transmission electron microscopy sample lamellae using a focused ion beam including directing a high energy focused ion beam toward a bulk volume of material; milling away the unwanted volume of material to produce an unfinished sample lamella with one or more exposed faces having a damage layer; characterizing the removal rate of the focused ion beam; subsequent to characterizing the removal rate, directing a low energy focused ion beam toward the unfinished sample lamella for a predetermined milling time to deliver a specified dose of ions per area from the low energy focused ion beam; and milling the unfinished sample lamella with the low energy focused ion beam to remove at least a portion of the damage layer to produce the finished sample lamella including at least a portion of the feature of interest.Type: GrantFiled: August 31, 2012Date of Patent: November 5, 2019Assignee: FEI CompanyInventors: Thomas G. Miller, Jason Arjavac, Michael Moriarty
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Publication number: 20170062178Abstract: An improved process workflow and apparatus for S/TEM sample preparation and analysis is provided. Preferred embodiments provide improved methods for an automated recipe TEM sample creation, especially for small geometry TEM lamellae, employing CAD data to automatically align various stages of sample preparation. The process automatically verifies and aligns the position of FIB-created fiducials by masking off portions of acquired images, and then comparing them to synthesized images from CAD data. SEM beam positions are verified by comparison to images synthesized from CAD data. FIB beam position is also verified by comparison to already-aligned SEM images, or by synthesizing an FIB image from CAD using techniques for simulating FIB images. The automatic alignment techniques herein allow creation of sample lamellas at specified locations without operator intervention.Type: ApplicationFiled: September 28, 2015Publication date: March 2, 2017Applicant: FEI CompanyInventors: Jason Arjavac, Matthew P. Knowles
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Patent number: 9581526Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: February 18, 2016Date of Patent: February 28, 2017Assignee: FEI COMPANYInventors: Jason Arjavac, Pei Zou, David James Tasker, Maximus Theodorus Otten, Gerhard Daniel
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Patent number: 9576772Abstract: An improved process workflow and apparatus for S/TEM sample preparation and analysis is provided. Preferred embodiments provide improved methods for an automated recipe TEM sample creation, especially for small geometry TEM lamellae, employing CAD data to automatically align various stages of sample preparation. The process automatically verifies and aligns the position of FIB-created fiducials by masking off portions of acquired images, and then comparing them to synthesized images from CAD data. SEM beam positions are verified by comparison to images synthesized from CAD data. FIB beam position is also verified by comparison to already-aligned SEM images, or by synthesizing an FIB image from CAD using techniques for simulating FIB images. The automatic alignment techniques herein allow creation of sample lamellas at specified locations without operator intervention.Type: GrantFiled: September 28, 2015Date of Patent: February 21, 2017Assignee: FEI CompanyInventors: Jason Arjavac, Matthew P. Knowles
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Publication number: 20160163506Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: ApplicationFiled: February 18, 2016Publication date: June 9, 2016Applicant: FEI CompanyInventors: Jason Arjavac, Pei Zou, David James Tasker, Maximus Theodorus Otten, Gerhard Daniel
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Patent number: 9349570Abstract: An improved method and apparatus for extracting and handling samples for S/TEM analysis. Preferred embodiments of the present invention make use of a micromanipulator and a hollow microprobe probe using vacuum pressure to adhere the microprobe tip to the sample. By applying a small vacuum pressure to the lamella through the microprobe tip, the lamella can be held more securely and its placement controlled more accurately than by using electrostatic force alone. By using a probe having a beveled tip and which can also be rotated around its long axis, the extracted sample can be placed down flat on a sample holder. This allows sample placement and orientation to be precisely controlled, thus greatly increasing predictability of analysis and throughput.Type: GrantFiled: March 31, 2015Date of Patent: May 24, 2016Assignee: FEI CompanyInventors: Enrique Agorio, James Edgar Hudson, Gerhard Daniel, Michael Tanguay, Jason Arjavac
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Patent number: 9275831Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: November 18, 2014Date of Patent: March 1, 2016Assignee: FEI CompanyInventors: Jason Arjavac, Pei Zou, David James Tasker, Maximus Theodorus Otten, Gerhard Daniel
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Publication number: 20150311034Abstract: An improved method and apparatus for extracting and handling samples for S/TEM analysis. Preferred embodiments of the present invention make use of a micromanipulator and a hollow microprobe probe using vacuum pressure to adhere the microprobe tip to the sample. By applying a small vacuum pressure to the lamella through the microprobe tip, the lamella can be held more securely and its placement controlled more accurately than by using electrostatic force alone. By using a probe having a beveled tip and which can also be rotated around its long axis, the extracted sample can be placed down flat on a sample holder. This allows sample placement and orientation to be precisely controlled, thus greatly increasing predictability of analysis and throughput.Type: ApplicationFiled: March 31, 2015Publication date: October 29, 2015Inventors: Enrique Agorio, James Edgar Hudson, Gerhard Daniel, Michael Tanguay, Jason Arjavac
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Publication number: 20150206707Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: ApplicationFiled: November 18, 2014Publication date: July 23, 2015Inventors: Jason Arjavac, Pei Zou, David James Tasker, Maximus Theodorus Otten, Gerhard Daniel
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Patent number: 8993962Abstract: An improved method and apparatus for extracting and handling samples for S/TEM analysis. Preferred embodiments of the present invention make use of a micromanipulator and a hollow microprobe probe using vacuum pressure to adhere the microprobe tip to the sample. By applying a small vacuum pressure to the lamella through the microprobe tip, the lamella can be held more securely and its placement controlled more accurately than by using electrostatic force alone. By using a probe having a beveled tip and which can also be rotated around its long axis, the extracted sample can be placed down flat on a sample holder. This allows sample placement and orientation to be precisely controlled, thus greatly increasing predictability of analysis and throughput.Type: GrantFiled: January 21, 2013Date of Patent: March 31, 2015Assignee: FEI CompanyInventors: Enrique Agorio, James Edgar Hudson, Gerhard Daniel, Michael Tanguay, Jason Arjavac
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Patent number: 8912488Abstract: A method for aligning a sample that is placed in the vacuum chamber so that the sample is oriented normal to the focused ion beam is disclosed. The locations of different spots on the sample surface are determined using a focusing routine. The locations of the different spots are used to create an image line or an image plane that determines the proper calibrations that are needed. The image line or image plane is then used to calibrate the sample stage so that the sample is aligned substantially normal to the focused ion beam.Type: GrantFiled: November 15, 2012Date of Patent: December 16, 2014Assignee: FEI CompanyInventor: Jason Arjavac
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Patent number: 8890064Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: February 26, 2013Date of Patent: November 18, 2014Assignee: FEI CompanyInventors: Jason Arjavac, Pei Zou, David James Tasker, Maximus Theodorus Otten, Gerhard Daniel
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Patent number: 8884247Abstract: A method and system for creating an asymmetrical lamella for use in an ex situ TEM, SEM, or STEM procedure is disclosed. The shape of the lamella provides for easy orientation such that a region of interest in the lamella can be placed over a hole in a carbon film providing minimal optical and spectral interference from the carbon film during TEM, SEM, or STEM procedure of chemical analysis.Type: GrantFiled: September 25, 2012Date of Patent: November 11, 2014Assignee: FEI CompanyInventors: Thomas G. Miller, Jason Arjavac, Damon Heer, Michael Strauss, Gerardus Nicolaas Anne van Veen
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Publication number: 20140131572Abstract: A method for aligning a sample that is placed in the vacuum chamber so that the sample is oriented normal to the focused ion beam is disclosed. The locations of different spots on the sample surface are determined using a focusing routine. The locations of the different spots are used to create an image line or an image plane that determines the proper calibrations that are needed. The image line or image plane is then used to calibrate the sample stage so that the sample is aligned substantially normal to the focused ion beam.Type: ApplicationFiled: November 15, 2012Publication date: May 15, 2014Inventor: Jason Arjavac
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Publication number: 20140084157Abstract: A method and system for creating an asymmetrical lamella for use in an ex situ TEM, SEM, or STEM procedure is disclosed. The shape of the lamella provides for easy orientation such that a region of interest in the lamella can be placed over a hole in a carbon film providing minimal optical and spectral interference from the carbon film during TEM, SEM, or STEM procedure of chemical analysis.Type: ApplicationFiled: September 25, 2012Publication date: March 27, 2014Applicant: FEI CompanyInventors: Thomas G. Miller, Jason Arjavac, Damon Heer, Michael Strauss, Gerardus Nicolaas Anne van Veen
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Publication number: 20140061032Abstract: A method, system, and computer-readable medium for forming transmission electron microscopy sample lamellae using a focused ion beam including directing a high energy focused ion beam toward a bulk volume of material; milling away the unwanted volume of material to produce an unfinished sample lamella with one or more exposed faces having a damage layer; characterizing the removal rate of the focused ion beam; subsequent to characterizing the removal rate, directing a low energy focused ion beam toward the unfinished sample lamella for a predetermined milling time to deliver a specified dose of ions per area from the low energy focused ion beam; and milling the unfinished sample lamella with the low energy focused ion beam to remove at least a portion of the damage layer to produce the finished sample lamella including at least a portion of the feature of interest.Type: ApplicationFiled: August 31, 2012Publication date: March 6, 2014Applicant: FEI CompanyInventors: Thomas G. Miller, Jason Arjavac, Michael Moriarty
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Patent number: 8525137Abstract: An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. A novel sample structure and a novel use of a milling pattern allow the creation of S/TEM samples as thin as 50 nm without significant bowing or warping. Preferred embodiments of the present invention provide methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.Type: GrantFiled: October 22, 2007Date of Patent: September 3, 2013Assignee: Fei CompanyInventors: Jeff Blackwood, Stacey Stone, Jason Arjavac