Abstract: An orthopaedic prosthesis includes a femoral component comprising polymeric materials. The polymeric materials may include a polyaromatic ether or a polyacetal. The orthopaedic prosthesis may include a component having an articular layer and a support layer adjacent the articular layer. The support layer may include a reinforcement fiber. The orthopaedic prosthesis may be a knee prosthesis.

Abstract: An orthopaedic prosthesis includes a femoral component comprising polymeric materials. The polymeric materials may include a polyaromatic ether or a polyacetal. The orthopaedic prosthesis may include a component having an articular layer and a support layer adjacent the articular layer. The support layer may include a reinforcement fiber. The orthopaedic prosthesis may be a knee prosthesis.

Abstract: An acetabular hip implant includes a plurality of rings secured to an acetabular shell component. A method of fabricating a customized, patient-specific version of such an implant is also disclosed.

Abstract: An acetabular hip implant includes a plurality of rings secured to an acetabular shell component. A method of fabricating a customized, patient-specific version of such an implant is also disclosed.

Abstract: A method of treating an articular surface of a metal orthopedic implant includes polishing the surface, blasting the surface with a blast media after the first polishing step and polishing the blasted surface of the metal orthopedic implant after the blasting step. The blasting step roughens the surface to create a surface skew Rsk/Ssk defined by peaks and valleys. The second polishing step reduces the surface skew to a negative skew Rsk/Ssk and produces an average roughness Ra/Sa that is acceptable. Lubrication at the interface of the treated articular surface and the corresponding bearing articular surface is improved, thereby improving wear resistance. Both polishing steps may be performed by drag finishing the surface through an abrasive media.

Abstract: A method of treating an articular surface of a metal orthopaedic implant includes polishing the surface, blasting the surface with a blast media after the first polishing step and polishing the blasted surface of the metal orthopaedic implant after the blasting step. The blasting step roughens the surface to create a surface skew Rsk/Ssk defined by peaks and valleys. The second polishing step reduces the surface skew to a negative skew Rsk/Ssk and produces an average roughness Ra/Sa that is acceptable. Lubrication at the interface of the treated articular surface and the corresponding bearing articular surface is improved, thereby improving wear resistance. Both polishing steps may be performed by drag finishing the surface through an abrasive media.

Abstract: Orthopaedic implants with scratch-, wear- and corrosion-resistant ceramic coatings on metal substrates are provided, as well as methods for making such coatings. The metal substrate is advantageously HIP'd and homogenized prior to coating with the ceramic, and the HIP'd and homogenized metal substrate is preferably ground and polished prior to coating with the ceramic. The ceramic coating may include a band with multiple thin alternating layers of titanium nitride, titanium carbonitride or both titanium nitride and titanium carbonitride, and may include an alumina overcoat. The present coatings curtail the growth of microcracks that can otherwise result from surface cracks or scratches on coated substrates, and thereby provide improved wear characteristics, scratch resistance, and prevent the penetration of corrosive fluids to the substrate material.

Abstract: Provided are scratch-, wear- and corrosion-resistant coatings for metal substrates, including orthopedic implants and other metal-containing constructs, as well as methods for making such coatings. The inventive coatings comprise multiple micron-width layers of titanium nitride, titanium carbonitride, or both titanium nitride and titanium carbonitride, and may also contain a layer of aluminum oxide, and may be characterized by alternating layers of titanium nitride and titanium carbonitride. The present coatings curtail the growth of microcracks that can otherwise result from surface cracks or scratches on coated substrates, and thereby provide improved wear characteristics, resist scratching, and prevent the penetration of corrosive fluids to the substrate material.

Abstract: Provided are scratch-, wear- and corrosion-resistant coatings for metal substrates, including orthopedic implants and other metal-containing constructs, as well as methods for making such coatings. The inventive coatings comprise multiple micron-width layers of titanium nitride, titanium carbonitride, or both titanium nitride and titanium carbonitride, and may also contain a layer of aluminum oxide, and may be characterized by alternating layers of titanium nitride and titanium carbonitride. The present coatings curtail the growth of microcracks that can otherwise result from surface cracks or scratches on coated substrates, and thereby provide improved wear characteristics, resist scratching, and prevent the penetration of corrosive fluids to the substrate material.

Abstract: A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.

Abstract: A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.

Abstract: An oscillator package with an improved crystal mount. The oscillator package has substrate with a top cavity and a bottom cavity. Vias extend through the substrate between the top and bottom cavities. A semiconductor die is located in the bottom cavity and is covered by a sealant. A crystal is located in the top cavity. The crystal is mounted in the top cavity using a thermosonically deposited gold bump. The gold bump is attached between an electrode pad and a contact pad. The gold bump provides an electrical connection between the crystal and the substrate and supports the crystal. A cover and seal ring are attached to substrate to hermetically seal the top cavity.