Patents by Inventor Jason Barnabas Langhorn

Jason Barnabas Langhorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-machined semiconductor package
    Patent number: 6965168
    Abstract: A hermetic multi-layered ceramic semiconductor package for micro-machined semiconductor devices. The package has a substrate with top and bottom surfaces. A micro-machined semiconductor device is located adjacent to the top surface. Vias extend through the substrate between the surfaces. The micro-machined semiconductor device is electrically connected to the vias. A rigid support is located between the micro-machined semiconductor device and the top surface to support the micro-machined semiconductor device during assembly and to space the micro-machined semiconductor device from the top surface. Solder spheres are mounted to the bottom surface and are connected to the vias.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: November 15, 2005
    Assignee: CTS Corporation
    Inventor: Jason Barnabas Langhorn
  • Micro-machined semiconductor package
    Publication number: 20030160310
    Abstract: A hermetic multi-layered ceramic semiconductor package for micro-machined semiconductor devices. The package has a substrate with top and bottom surfaces. A micro-machined semiconductor device is located adjacent to the top surface. Vias extend through the substrate between the surfaces. The micro-machined semiconductor device is electrically connected to the vias. A rigid support is located between the micro-machined semiconductor device and the top surface to support the micro-machined semiconductor device during assembly and to space the micro-machined semiconductor device from the top surface. Solder spheres are mounted to the bottom surface and are connected to the vias.
    Type: Application
    Filed: February 26, 2002
    Publication date: August 28, 2003
    Inventor: Jason Barnabas Langhorn