Abstract: An additive building method for building a plurality of layers to form a build stack is provided. The method includes creating a variable potential difference between a conducting element at a first voltage potential and an ion source at a second voltage potential, and creating an electric field between the conducting element and the ion source. The electric field passes through the build stack to a nearest surface of the build stack which is nearest a transfer medium. The method further includes accumulating electric charge from the ion source on the nearest surface of the build stack, and transferring deposition material from a transfer medium onto the nearest surface. The strength of the field at the nearest surface of the build stack is controlled in order to cause a homogenous transfer of the deposition material on to the nearest surface.