Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.

Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.

Abstract: An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.

Abstract: A heat sink for use with a thermal pad includes a heat sink body to engage the thermal pad, and a plurality of relief holes formed within the heat sink body, wherein the plurality of relief holes receives a portion of the thermal pad to limit an applied heat sink pressure onto the component.

Abstract: An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.

Abstract: An assembly includes a housing, a first locking rail, and a second locking rail. The housing has first and second sidewalls. First and second guiderails extend from the first sidewall toward the second sidewall. Third and fourth guiderails extend from the second sidewall toward the first sidewall. The first locking rail is positioned between the first guiderail and the second guiderail. The first locking rail has a first surface nearest the first guiderail and a second surface nearest the second guiderail. The first surface is inclined with respect to the second surface. The second locking rail is positioned between the third guiderail and the fourth guiderail. The second locking rail has a third surface nearest the third guiderail and a fourth surface nearest the fourth guiderail. The third surface is inclined with respect to the fourth surface.