Abstract: A non-kingpin trailer can be coupled to a towing vehicle having a towball in the bed of the towing vehicle. For example, the non-kingpin trailer can be coupled to the towing vehicle by installing a trailer coupler system in the bed of the towing vehicle by securing the trailer coupler system to the towball in the bed of the towing vehicle and securing the adapter hitch to the trailer coupler system by inserting the first towball of the trailer coupler system into the towball receptacle of the adapter hitch.

Abstract: A trailer coupler system can include one or more skid plates made from extruded aluminum, one or more support tubes attached to the skid plates, a plurality of struts having a first end attached to the one or more skid plates, a ball housing attached to a second end of at least two of the plurality of struts, a first towball positioned within the ball housing, an adapter sleeve attached to the ball housing, a support plate extending from a support tube or skid plate to the adapter sleeve, an adapter having a kingpin coupler for coupling to a kingpin of a trailer, and a towball coupler for directly coupling with the first towball.

Abstract: A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

Abstract: A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

Abstract: A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

Abstract: A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

Abstract: A first down indicator system adapted for removable attachment to a first down marker post of markers of the type used in football games for marking a distance of ten yards to determine first down measurement.

Abstract: A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.