Patents by Inventor Jason C. McFarland

Jason C. McFarland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12232314
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: February 18, 2025
    Assignee: Lodestar Licensing Group LLC
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Publication number: 20230354595
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Application
    Filed: June 12, 2023
    Publication date: November 2, 2023
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Patent number: 11678481
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: June 13, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Publication number: 20210167079
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Application
    Filed: February 11, 2021
    Publication date: June 3, 2021
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Patent number: 10930659
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: February 23, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Patent number: 10600796
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: March 24, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Publication number: 20190355735
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Application
    Filed: August 5, 2019
    Publication date: November 21, 2019
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson
  • Publication number: 20180366481
    Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 20, 2018
    Inventors: Rohit Kothari, Jason C. McFarland, Jason Reece, David A. Kewley, Adam L. Olson