Patents by Inventor Jason C. Wing

Jason C. Wing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for singulating semiconductor components
    Patent number: 6787382
    Abstract: A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage alignment step, and a vacuum cutting base for holding the nest and the substrate during a cutting step. The prestage alignment base includes locator pins configured to engage locator openings on the substrate to align the substrate on the nest. As the cutting base does not include the locator pins, the cutting step can be performed without saw scrap collecting on the locator pins. A system for performing the method includes the nest and the prestage alignment base having the locator pins configured to engage the locator openings on the substrate. The system also includes the sawing base which includes pedestals with vacuum conduits for holding the substrate stationary on the nest for sawing.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: September 7, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jason C. Wing, Gregory M. Chapman
  • System for singulating semiconductor components utilizing alignment pins
    Patent number: 6683378
    Abstract: A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage alignment step, and a vacuum cutting base for holding the nest and the substrate during a cutting step. The prestage alignment base includes locator pins configured to engage locator openings on the substrate to align the substrate on the nest. As the cutting base does not include the locator pins, the cutting step can be performed without saw scrap collecting on the locator pins. A system for performing the method includes the nest and the prestage alignment base having the locator pins configured to engage the locator openings on the substrate. The system also includes the sawing base which includes pedestals with vacuum conduits for holding the substrate stationary on the nest for sawing.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: January 27, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jason C. Wing, Gregory M. Chapman
  • SYSTEM FOR SINGULATING SEMICONDUCTOR COMPONENTS UTILIZING ALIGNMENT PINS
    Publication number: 20030200855
    Abstract: A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage alignment step, and a vacuum cutting base for holding the nest and the substrate during a cutting step. The prestage alignment base includes locator pins configured to engage locator openings on the substrate to align the substrate on the nest. As the cutting base does not include the locator pins, the cutting step can be performed without saw scrap collecting on the locator pins. A system for performing the method includes the nest and the prestage alignment base having the locator pins configured to engage the locator openings on the substrate. The system also includes the sawing base which includes pedestals with vacuum conduits for holding the substrate stationary on the nest for sawing.
    Type: Application
    Filed: April 29, 2003
    Publication date: October 30, 2003
    Inventors: Jason C. Wing, Gregory M. Chapman