Patents by Inventor Jason Christopherson

Jason Christopherson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10591373
    Abstract: In one aspect, a transducer body, includes a support including a pair of clevis halves; and a sensor body coupled to each of the clevis halves. The sensor body is disposed between the clevis halves and includes a generally rigid peripheral member disposed about a spaced-apart central hub, the central hub being joined to each of the clevis halves with the peripheral member spaced apart from each clevis half, where at least three flexure components couple the peripheral member to the central hub, and where the flexure components are spaced-apart from each other at generally equal angle intervals about the central hub. A biasing assembly connected between the support and the sensor body is configured to provide a bias force between the sensor body and the support.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: March 17, 2020
    Assignee: MTS SYSTEMS CORPORATION
    Inventors: Richard A. Meyer, Robert L. Josephson, Jason A. Christopherson, Todd Robert Osmundson, Nicholas Devon LaMoore, Riley August Rogotzke
  • Patent number: 9778122
    Abstract: In one aspect, a transducer body includes a support having clevis halves. The sensor body includes a generally rigid peripheral member disposed about a spaced-apart central hub joined to each of the clevis halves. At least three flexure components couple the peripheral member to the hub. The flexure components are spaced-apart from each other at generally equal angle intervals about the hub; the sensor body further including a flexure assembly for some flexure components joining the flexure component to at least one of the hub and the peripheral member, the flexure assembly being compliant for forces in a radial direction from the hub to the peripheral member. Each flexure assembly is configured such that forces transferred concentrate strain at a midpoint along the length of each corresponding flexure component.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: October 3, 2017
    Assignee: MTS SYSTEMS CORPORATION
    Inventors: Richard A. Meyer, Robert L. Josephson, Jason A. Christopherson, Todd Robert Osmundson, Nicholas Devon LaMoore, Riley August Rogotzke
  • Publication number: 20170191889
    Abstract: In one aspect, a transducer body, includes a support including a pair of clevis halves; and a sensor body coupled to each of the clevis halves. The sensor body is disposed between the clevis halves and includes a generally rigid peripheral member disposed about a spaced-apart central hub, the central hub being joined to each of the clevis halves with the peripheral member spaced apart from each clevis half, where at least three flexure components couple the peripheral member to the central hub, and where the flexure components are spaced-apart from each other at generally equal angle intervals about the central hub. A biasing assembly connected between the support and the sensor body is configured to provide a bias force between the sensor body and the support.
    Type: Application
    Filed: March 3, 2017
    Publication date: July 6, 2017
    Inventors: Richard A. Meyer, Robert L. Josephson, Jason A. Christopherson, Todd Robert Osmundson, Nicholas Devon LaMoore, Riley August Rogotzke
  • Publication number: 20150160083
    Abstract: In one aspect, a platform balance includes a frame support, and at least three spaced-apart transducer bodies coupled to the frame support. Each transducer body includes a support having clevis halves. The sensor body includes a generally rigid peripheral member disposed about a spaced-apart central hub joined to each of the clevis halves. At least three flexure components couple the peripheral member to the hub. The flexure components are spaced-apart from each other at generally equal angle intervals about the hub; the sensor body further including a flexure assembly for some flexure components joining the flexure component to at least one of the hub and the peripheral member, the flexure assembly being compliant for forces in a radial direction from the hub to the peripheral member. Each flexure assembly is configured such that forces transferred concentrate strain at a midpoint along the length of each corresponding flexure component.
    Type: Application
    Filed: August 1, 2014
    Publication date: June 11, 2015
    Inventors: Richard A. Meyer, Robert L. Josephson, Jason A. Christopherson, Todd Robert Osmundson, Nicholas Devon LaMoore, Riley August Rogotzke
  • Publication number: 20150033875
    Abstract: In one aspect, a transducer body includes a support having clevis halves. The sensor body includes a generally rigid peripheral member disposed about a spaced-apart central hub joined to each of the clevis halves. At least three flexure components couple the peripheral member to the hub. The flexure components are spaced-apart from each other at generally equal angle intervals about the hub; the sensor body further including a flexure assembly for some flexure components joining the flexure component to at least one of the hub and the peripheral member, the flexure assembly being compliant for forces in a radial direction from the hub to the peripheral member. Each flexure assembly is configured such that forces transferred concentrate strain at a midpoint along the length of each corresponding flexure component.
    Type: Application
    Filed: August 1, 2014
    Publication date: February 5, 2015
    Inventors: Richard A. Meyer, Robert L. Josephson, Jason A. Christopherson, Todd Robert Osmundson, Nicholas Devon LaMoore, Riley Rogotzke
  • Publication number: 20070017300
    Abstract: A test assembly structure having a first specimen support, a displacement mechanism joined to the first specimen support and a second specimen support. A loading assembly is joined to the second specimen support and configured so as to engage a specimen held by the second specimen support with a specimen held by the first specimen support. A self-reacting structure is joined to the loading assembly having a flexure substantially rigid in the direction of loading of the loading assembly and substantially compliant in the direction of displacement of the displacement mechanism. A second flexure can be configured to support the second specimen support and/or loading assembly on a base. The second flexure is substantially compliant in the direction of loading of the loading assembly and substantially rigid in the direction of displacement of the displacement mechanism.
    Type: Application
    Filed: July 20, 2006
    Publication date: January 25, 2007
    Applicant: MTS Systems Corporation
    Inventors: John Bushey, Jason Christopherson, Steven Haeg
  • Patent number: 6855638
    Abstract: A method processes a thick TiW metal layer (12) on a dielectric layer (15), where the dielectric layer (15) has been deposited on a substrate (14), such as a silicon substrate. The method deposits the TiW metal layer (12) onto the dielectric layer (15), such as silicon dioxide or silicon nitride, and then deposits a photoresist (10) over the TiW metal layer (12). The method removes substantially all of the TiW metal layer (12) not in contact with the photoresist (10) with a uniform etch, such as not more than 80% to 90% of the deposited TiW metal layer. Then, the TiW metal layer (12) is selectively etched to the dielectric layer (15), to remove the TiW metal layer (12) faster than the dielectric layer (15), such as 2.7 times faster.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: February 15, 2005
    Assignee: Union Semiconductor Technology Corporation
    Inventors: Hans Peter Mikelson, Michael Paul Fleischer, Gloria Marie Lee, Jason Christopherson
  • Publication number: 20040192062
    Abstract: A method processes a thick TiW metal layer (12) on a dielectric layer (15), where the dielectric layer (15) has been deposited on a substrate (14), such as a silicon substrate. The method deposits the TiW metal layer (12) onto the dielectric layer (15), such as silicon dioxide or silicon nitride, and then deposits a photoresist (10) over the TiW metal layer (12). The method removes substantially all of the TiW metal layer (12) not in contact with the photoresist (10) with a uniform etch, such as not more than 80% to 90% of the deposited TiW metal layer. Then, the TiW metal layer (12) is selectively etched to the dielectric layer (15), to remove the TiW metal layer (12) faster than the dielectric layer (15), such as 2.7 times faster.
    Type: Application
    Filed: March 24, 2003
    Publication date: September 30, 2004
    Inventors: Hans Peter Mikelson, Michael Paul Fleischer, Gloria Marie Lee, Jason Christopherson