Abstract: A cooling system may include a first domain having a first fluid inlet and a first fluid outlet. A cooling system may include a second domain having a second fluid inlet and a second fluid outlet. A cooling system may include a thermal break between the first domain and the second domain. The thermal break includes a thermal gap separating the first domain and the second domain by 1 mm or less.

Abstract: A server system is provided that includes one or more compute nodes that include at least one processor and a host memory device. The server system further includes a plurality of solid-state drive (SSD) devices, a local non-volatile memory express virtualization (LNV) device, and a non-transparent (NT) switch for a peripheral component interconnect express (PCIe) bus that interconnects the plurality of SSD devices and the LNV device to the at least one processor of each compute node. The LNV device is configured to virtualize hardware resources of the plurality of SSD devices. The plurality of SSD devices are configured to directly access data buffers of the host memory device. The NT switch is configured to hide the plurality of SSD devices such that the plurality of SSD devices are not visible to the at least one processor of each compute node.

Abstract: A computing device assembly is provided, including a rack, and a plurality of compute units that are horizontally oriented and mounted within the rack in one of two vertical stacks. The computing device assembly further includes a plurality of switches that are vertically oriented and mounted along a front side of the rack laterally between the two vertical stacks of compute units. The computing device assembly further includes a plurality of horizontal cable backplanes mounted in a vertical stack along a rear side of the rack. The computing device assembly further includes a plurality of vertical cable shuffles mounted between the two vertical stacks of compute units and between the vertically oriented switches and the vertical stack of horizontal cable backplanes.

Abstract: A signal conditioning connector assembly is provided, including an enclosure, and a plurality of signal conditioner layers mounted within the enclosure. Each signal conditioner layer includes a substrate, signal conditioner circuitry mounted to the substrate, first electrodes forming a first connector on a first side of the signal conditioner circuitry, second electrodes forming a second connector on a second side of the signal conditioner circuitry, a heat spreader in thermal communication with a side of the signal conditioner circuitry opposite the substrate, and a liquid cooling pipe positioned adjacent and in thermal communication with the heat spreader. The liquid cooling pipe is configured to draw heat away from the heat spreader for thermal management. The signal conditioning connector assembly can be positioned adjacent an interface between the vertical cable shuffle and the horizontal cable backplane within the rack of the computing device assembly of the first and second aspects.

Abstract: A transparent substrate that encodes data therein having optically readable identification indicia corresponding to identifying information regarding the substrate. The optically readable identification indicia may be readable from the transparent substrate by altering the reflectivity of the transparent substrate in indicia portions that may be read by a scanner or reader (e.g., a barcode reader). The optically readable identification indicia may be provided on a common surface with a data zone in which data is encoded in the transparent substrate. Alternatively or additionally, the optically readable identification indicia may be provided on another, different surface than the surface on which the data is encoded in a data zone.

Abstract: An electronic equipment rack including a chassis configured to support an electronic device within a moveable drawer. The electronic equipment rack may further include a cable management arm coupled to a front side of the electronic equipment rack by a first hinge. The cable management arm may include a cable management structure and may further include a cable anchor point at which a fixed portion of the cable management structure is held at a fixed distance from a reference point located on the chassis. The cable management arm may be configured to be rotatable around the first hinge between a closed position and an open position in which the moveable drawer is configured to be moved inward and outward relative to the chassis. The electronic equipment rack may further include a communication connector located proximate an end of the cable management structure.

Abstract: A transparent substrate that encodes data therein having optically readable identification indicia corresponding to identifying information regarding the substrate. The optically readable identification indicia may be readable from the transparent substrate by altering the reflectivity of the transparent substrate in indicia portions that may be read by a scanner or reader (e.g., a barcode reader). The optically readable identification indicia may be provided on a common surface with a data zone in which data is encoded in the transparent substrate. Alternatively or additionally, the optically readable identification indicia may be provided on another, different surface than the surface on which the data is encoded in a data zone.

Abstract: A cooling system may include a first domain having a first fluid inlet and a first fluid outlet. A cooling system may include a second domain having a second fluid inlet and a second fluid outlet. A cooling system may include a thermal break between the first domain and the second domain. The thermal break includes a thermal gap separating the first domain and the second domain by 1 mm or less.

Abstract: A thermal management system for a computing device includes a support board, a heat-generating component fixed to the support board, an enclosure, and a PCM. The heat-generating component is fixed to the support board on a first side of the support board, and the enclosure is fixed to the first side of the support board and encloses at least the heat-generating component. The PCM is positioned in the enclosure and configured to receive heat from the heat-generating component. The PCM is solid at 10° C.

Abstract: The described technology provides implementations of a storage device carrier assembly adapted to removably mate with a chassis. The storage device carrier assembly includes a storage device carrier adapted to be coupled to a storage device and a biased latch attached to the storage device carrier and adapted to transition from an engaged state to a retracted state to remove the storage device carrier from the chassis, wherein the biased latch includes extendable portions adapted to engage the chassis in the engaged state.

Abstract: A server system is provided that includes one or more compute nodes that include at least one processor and a host memory device. The server system further includes a plurality of solid-state drive (SSD) devices, a local non-volatile memory express virtualization (LNV) device, and a non-transparent (NT) switch for a peripheral component interconnect express (PCIe) bus that interconnects the plurality of SSD devices and the LNV device to the at least one processor of each compute node. The LNV device is configured to virtualize hardware resources of the plurality of SSD devices. The plurality of SSD devices are configured to directly access data buffers of the host memory device. The NT switch is configured to hide the plurality of SSD devices such that the plurality of SSD devices are not visible to the at least one processor of each compute node.

Abstract: The described technology provides implementations of a storage device carrier assembly adapted to removably mate with a chassis. The storage device carrier assembly includes a storage device carrier adapted to be coupled to a storage device and a biased latch attached to the storage device carrier and adapted to transition from an engaged state to a retracted state to remove the storage device carrier from the chassis, wherein the biased latch includes extendable portions adapted to engage the chassis in the engaged state.

Abstract: A server system is provided that includes one or more compute nodes that include at least one processor and a host memory device. The server system further includes a plurality of solid-state drive (SSD) devices, a local non-volatile memory express virtualization (LNV) device, and a non-transparent (NT) switch for a peripheral component interconnect express (PCIe) bus that interconnects the plurality of SSD devices and the LNV device to the at least one processor of each compute node. The LNV device is configured to virtualize hardware resources of the plurality of SSD devices. The plurality of SSD devices are configured to directly access data buffers of the host memory device. The NT switch is configured to hide the plurality of SSD devices such that the plurality of SSD devices are not visible to the at least one processor of each compute node.

Abstract: A thermal management system for a computing device includes a support board, a heat-generating component fixed to the support board, an enclosure, and a PCM. The heat-generating component is fixed to the support board on a first side of the support board, and the enclosure is fixed to the first side of the support board and encloses at least the heat-generating component. The PCM is positioned in the enclosure and configured to receive heat from the heat-generating component. The PCM is solid at 10° C.

Abstract: An electronic equipment rack including a chassis configured to support an electronic device within a moveable drawer. The electronic equipment rack may further include a cable management arm coupled to a front side of the electronic equipment rack by a first hinge. The cable management arm may include a cable management structure and may further include a cable anchor point at which a fixed portion of the cable management structure is held at a fixed distance from a reference point located on the chassis. The cable management arm may be configured to be rotatable around the first hinge between a closed position and an open position in which the moveable drawer is configured to be moved inward and outward relative to the chassis. The electronic equipment rack may further include a communication connector located proximate an end of the cable management structure.

Abstract: Examples are disclosed that relate to attenuating fan noise in a computing storage system comprising magnetic data storage devices. One example provides a computing storage system comprising an enclosure, a plurality of magnetic data storage devices positioned within the enclosure, one or more fans positioned to cool the magnetic data storage devices, and an acoustic attenuator located between the plurality of magnetic data storage devices and the one or more fans. The acoustic attenuator comprises a plurality of airflow channels each defined by one or more internal walls of the acoustic attenuator, wherein at least one of the plurality of airflow channels is configured to block a line of sight between the plurality of magnetic data storage devices and the one or more fans.

Abstract: A transparent substrate that encodes data therein having optically readable identification indicia corresponding to identifying information regarding the substrate. The optically readable identification indicia may be readable from the transparent substrate by altering the reflectivity of the transparent substrate in indicia portions that may be read by a scanner or reader (e.g., a barcode reader). The optically readable identification indicia may be provided on a common surface with a data zone in which data is encoded in the transparent substrate. Alternatively or additionally, the optically readable identification indicia may be provided on another, different surface than the surface on which the data is encoded in a data zone.

Abstract: A transparent substrate that encodes data therein having optically readable identification indicia corresponding to identifying information regarding the substrate. The optically readable identification indicia may be readable from the transparent substrate by altering the reflectivity of the transparent substrate in indicia portions that may be read by a scanner or reader (e.g., a barcode reader). The optically readable identification indicia may be provided on a common surface with a data zone in which data is encoded in the transparent substrate. Alternatively or additionally, the optically readable identification indicia may be provided on another, different surface than the surface on which the data is encoded in a data zone.

Abstract: A server system is provided that includes one or more compute nodes that include at least one processor and a host memory device. The server system further includes a plurality of solid-state drive (SSD) devices, a local non-volatile memory express virtualization (LNV) device, and a non-transparent (NT) switch for a peripheral component interconnect express (PCIe) bus that interconnects the plurality of SSD devices and the LNV device to the at least one processor of each compute node. The LNV device is configured to virtualize hardware resources of the plurality of SSD devices. The plurality of SSD devices are configured to directly access data buffers of the host memory device. The NT switch is configured to hide the plurality of SSD devices such that the plurality of SSD devices are not visible to the at least one processor of each compute node.

Abstract: A server system is provided that includes one or more compute nodes that include at least one processor and a host memory device. The server system further includes a plurality of solid-state drive (SSD) devices, a local non-volatile memory express virtualization (LNV) device, and a non-transparent (NT) switch for a peripheral component interconnect express (PCIe) bus that interconnects the plurality of SSD devices and the LNV device to the at least one processor of each compute node. The LNV device is configured to virtualize hardware resources of the plurality of SSD devices. The plurality of SSD devices are configured to directly access data buffers of the host memory device. The NT switch is configured to hide the plurality of SSD devices such that the plurality of SSD devices are not visible to the at least one processor of each compute node.