Patents by Inventor Jason E. Gaudette

Jason E. Gaudette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11893975
    Abstract: A linear transducer is connected to a first flexible member that has a first elongated shape with a first minor axis and a first major axis perpendicular to each other. This connects the linear transducer to opposite portions of the first flexible member along the first major axis. A second flexible member having an elongated shape with a second minor axis and a second major axis is provided. The second flexible member is connected to the first flexible member such that portions on the second major axis are joined to move with portions of the first flexible member on the first minor axis. Operation of the linear transducer multiplies displacements of the second flexible member relative to those of the transducer.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: February 6, 2024
    Inventors: Stephen C Butler, Dimitri Donskoy, Jason E Gaudette
  • Patent number: 11694668
    Abstract: A deployment module according to the present application enables both compact stowage of a sensor array and expansion of the sensor array into a three-dimensional volumetric array shape that enables improved directionality of the sensors during operation. The deployment module includes a support shell that is configured to retain a cable of the sensor array separately from sensors of the sensor array and an expandable deployment body formed of a superelastic shape memory alloy that uses superelasticity and stored energy for deployment of the sensor array. During deployment, the deployment body is removed from the support shell and the sensors are subsequently pulled out of the support shell. The deployment body then expands and holds the cable to retain the three-dimensional volumetric shape of the deployed array.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: July 4, 2023
    Assignee: Raytheon Company
    Inventors: Curtis B. Carlsten, Frederick B. Koehler, Jason E. Gaudette, Peter M. Willey
  • Publication number: 20210375250
    Abstract: A deployment module according to the present application enables both compact stowage of a sensor array and expansion of the sensor array into a three-dimensional volumetric array shape that enables improved directionality of the sensors during operation. The deployment module includes a support shell that is configured to retain a cable of the sensor array separately from sensors of the sensor array and an expandable deployment body formed of a superelastic shape memory alloy that uses superelasticity and stored energy for deployment of the sensor array. During deployment, the deployment body is removed from the support shell and the sensors are subsequently pulled out of the support shell. The deployment body then expands and holds the cable to retain the three-dimensional volumetric shape of the deployed array.
    Type: Application
    Filed: May 27, 2020
    Publication date: December 2, 2021
    Inventors: Curtis B. Carlsten, Frederick B. Koehler, Jason E. Gaudette, Peter M. Willey
  • Patent number: 11047370
    Abstract: A deployment body for a sensor array includes at least one superelastic spring formed of a shape memory alloy (SMA) material that enables activation of the deployment body. The SMA spring is configured to expand from a stowed position in which the SMA spring is wound around a central hub of the deployment body to a deployed position in which the SMA spring is extended in a radially outward direction relative to the central hub. A stiffness of the SMA spring enables the SMA spring to hold cables of the sensor array and maintain a deployed shape of the sensor array, which may be a volumetric array. Using the SMA material is advantageous in that the material is tuned to maintain superelasticity based on at least one of an intended operating temperature and a desired expansion ratio of stowed to deployed diameter of the deployment body.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: June 29, 2021
    Assignee: Raytheon Company
    Inventors: Frederick B. Koehler, Curtis B. Carlsten, Ward D. Lyman, Jason E. Gaudette