Patents by Inventor Jason E. Gerber

Jason E. Gerber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and semiconductor integrated circuit for monitoring link 16 compliance
    Patent number: 12726282
    Abstract: A Link 16 compliance monitoring system, and Link 16 compliance monitoring semiconductor integrated circuit, for LLD monitoring, frequency bin monitoring, and pulse width monitoring comprising an LLD monitoring subsystem, a frequency bin monitoring subsystem, and a pulse width monitoring subsystem, all sharing a frontend subsystem that performs A/D conversion of the inputted Link 16 transmission RF signal and that reduces overhead in digital signal processing by digitally multiplying the Link 16 transmission RF signal by a 1060 MHz complex sine wave waveform and then decimating the result.
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: September 1, 2026
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John H. Chongoushian, Joshua P. Mindler, Jason E. Gerber, Alexander Loh, Andrew W. Appel
  • SYSTEM AND SEMICONDUCTOR INTEGRATED CIRCUIT FOR MONITORING LINK 16 COMPLIANCE
    Publication number: 20260163653
    Abstract: A Link 16 compliance monitoring system, and Link 16 compliance monitoring semiconductor integrated circuit, for LLD monitoring, frequency bin monitoring, and pulse width monitoring comprising an LLD monitoring subsystem, a frequency bin monitoring subsystem, and a pulse width monitoring subsystem, all sharing a frontend subsystem that performs A/D conversion of the inputted Link 16 transmission RF signal and that reduces overhead in digital signal processing by digitally multiplying the Link 16 transmission RF signal by a 1060 MHz complex sine wave waveform and then decimating the result.
    Type: Application
    Filed: December 11, 2024
    Publication date: June 11, 2026
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: John H. Chongoushian, Joshua P. Mindler, Jason E. Gerber, Alexander Loh, Andrew W. Appel