Patents by Inventor Jason E. Snodgress

Jason E. Snodgress has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging method for circuit board
    Patent number: 7533457
    Abstract: A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: May 19, 2009
    Assignee: Intel Corporation
    Inventors: Richard B Foehringer, Jason E Snodgress, Steven R. Eskildsen, John G. Meyers
  • Low cost highly isolated RF coupler
    Patent number: 7109830
    Abstract: Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: September 19, 2006
    Assignee: Powerwave Technologies, Inc.
    Inventors: Richard Emil Sweeney, Jason E. Snodgress
  • Low cost highly isolated RF coupler
    Publication number: 20040037062
    Abstract: Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.
    Type: Application
    Filed: August 26, 2002
    Publication date: February 26, 2004
    Inventors: Richard Emil Sweeney, Jason E. Snodgress
  • Low cost hermetic sealed microwave module packaging
    Patent number: 6028007
    Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: February 22, 2000
    Assignee: TRW Inc.
    Inventors: Steven S. Chan, John E. Dowsing, III, Jason E. Snodgress
  • Low cost hermetic sealed microwave module packaging
    Patent number: 5956840
    Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: September 28, 1999
    Assignee: TRW Inc.
    Inventors: Steven S. Chan, John E. Dowsing, III, Jason E. Snodgress