Patents by Inventor Jason Edward Chan

Jason Edward Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
    Patent number: 8481866
    Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: July 9, 2013
    Assignee: Amphenol Corporation
    Inventors: Jason Edward Chan, Jose Ricardo Paniagua
  • ADJACENT PLATED THROUGH HOLES WITH STAGGERED COUPLINGS FOR CROSSTALK REDUCTION IN HIGH SPEED PRINTED CIRCUIT BOARDS
    Publication number: 20120000701
    Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 5, 2012
    Applicant: Amphenol Corporation
    Inventors: Jason Edward CHAN, Jose Ricardo Paniagua
  • Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
    Patent number: 7999192
    Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: August 16, 2011
    Assignee: Amphenol Corporation
    Inventors: Jason Edward Chan, Jose Ricardo Paniagua
  • Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
    Publication number: 20080227311
    Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 18, 2008
    Inventors: Jason Edward Chan, Jose Ricardo Paniagua