Patents by Inventor Jason Fender

Jason Fender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180014971
    Abstract: The present disclosure provides thermally conductive grafts and methods of passively cooling a hyperthermic region and preventing epilepsy, neural inflammation, and other neurological abnormalities using a thermally conductive graft including a thermally conductive matrix disposed between two opposed surfaces.
    Type: Application
    Filed: September 25, 2017
    Publication date: January 18, 2018
    Inventors: Raimondo D'Ambrosio, Samuel R. Browd, John W. Miller, Jeffrey G. Ojemann, Clifford L. Eastman, Matthew Smyth, Steven M. Rothman, Jason Fender
  • Publication number: 20170056240
    Abstract: Passive prosthetic devices for focally cooling a brain and methods for inhibiting seizures are disclosed. The prosthetic devices replace a thermally insulating bone flap with a thermally conductive insert having an inner surface that contacts the relatively warm meninges or brain and an outer surface that contacts the relatively cool scalp. In an embodiment, the prosthesis is unitary; in another, a biocompatible casing is filled with a highly conductive core; in another, a filled polymer block is attached to a plate; and in another, the bone flap is filled with a conductive polymer. In one embodiment, a filled polymer containing elements that exhibit the magnetocaloric effect provide heat transfer that can be enhanced by application of a suitable magnetic field. Focal cooling as low as 1.2° C. has been found effective at inhibiting seizures.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Inventors: Raimondo D'Ambrosio, Jason Fender, Jeffrey Ojemann, John W. Miller, Matthew Smyth, Steven M. Rothman
  • Patent number: 9522081
    Abstract: Passive prosthetic devices for focally cooling a brain and methods for inhibiting seizures are disclosed. The prosthetic devices replace a thermally insulating bone flap with a thermally conductive insert having an inner surface that contacts the relatively warm meninges or brain and an outer surface that contacts the relatively cool scalp. In an embodiment, the prosthesis is unitary; in another, a biocompatible casing is filled with a highly conductive core; in another, a filled polymer block is attached to a plate; and in another, the bone flap is filled with a conductive polymer. In one embodiment, a filled polymer containing elements that exhibit the magnetocaloric effect provide heat transfer that can be enhanced by application of a suitable magnetic field. Focal cooling as low as 1.2° C. has been found effective at inhibiting seizures.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: December 20, 2016
    Assignees: University of Washington, Washington University, Regents of the University of Minnesota
    Inventors: Raimondo D'Ambrosio, Jason Fender, Jeffrey Ojemann, John W. Miller, Matthew Smyth, Steven M. Rothman
  • Patent number: 8591562
    Abstract: A device for cooling the central nervous system (e.g., the brain) is disclosed that is specifically designed to provide cooling of an injured central nervous system for neuroprotective, antiepileptogenic, and/or antiepileptic treatments. In one embodiment, a portion of the cooling device is placed in a recess formed by removal of a portion of a patient's skull. An embedded heat-collecting portion of the cooling device is formed to fit in the location of the formed recess and a thermally conductive material of the heat-collecting portion is placed adjacent the dura mater to provide the desired degree of cooling. A heat-dissipating external plate is in thermal contact with the internal plate, and can be selectively sized according to a specific purpose.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: November 26, 2013
    Assignees: University of Washington, Regents of the University of Minnesota, Washington University in St. Louis
    Inventors: Raimondo D'Ambrosio, Matthew Smyth, Steven Mark Rothman, John W. Miller, Jason Fender
  • Publication number: 20120290052
    Abstract: Passive prosthetic devices for focally cooling a brain and methods for inhibiting seizures are disclosed. The prosthetic devices replace a thermally insulating bone flap with a thermally conductive insert having an inner surface that contacts the relatively warm meninges or brain and an outer surface that contacts the relatively cool scalp. In an embodiment, the prosthesis is unitary; in another, a biocompatible casing is filled with a highly conductive core; in another, a filled polymer block is attached to a plate; and in another, the bone flap is filled with a conductive polymer. In one embodiment, a filled polymer containing elements that exhibit the magnetocaloric effect provide heat transfer that can be enhanced by application of a suitable magnetic field. Focal cooling as low as 1.2° C. has been found effective at inhibiting seizures.
    Type: Application
    Filed: May 29, 2012
    Publication date: November 15, 2012
    Applicant: University of Washington through its Center for Commercialization
    Inventors: Raimondo D'Ambrosio, Jason Fender, Jeffrey Ojemann, John W. Miller
  • Patent number: 7339267
    Abstract: Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) and methods for fabricating the same are provided. An exemplary method comprises providing a semiconductor wafer stack (110) including metal pads (112) and a substrate (116). An adhesion/plating layer (115) is formed on the substrate (116). A layer of gold (118) is plated on the adhesion/plating layer (115). The layer of gold is etched in a street area (124) to expose edge portions (128) of the layer of gold (118) and the adhesion/plating layer (115). A layer of barrier metal (130) is deposited to form an edge seal (129) about the exposed edge portions (128). The edge seal (129) prevents the leaching of gold from back metal layers (118) into the solder (162) when the wafer stack (110) is soldered to a leadframe (162).
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: March 4, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Vasile Romega Thompson, Jason Fender, Terry K. Daly, Jin-Wook Jang
  • Publication number: 20070090156
    Abstract: A method is provided for forming a microelectronic assembly. A semiconductor substrate having a first thickness is mounted to a support substrate with a low temperature adhesive. The semiconductor substrate is thinned from the first thickness to a second thickness. At least one contact formation is formed on the semiconductor substrate, and high energy electromagnetic radiation is directed onto the at least one contact formation to reflow the at least one contact formation.
    Type: Application
    Filed: October 25, 2005
    Publication date: April 26, 2007
    Inventors: Lakshmi Ramanathan, Terry Daly, Jason Fender
  • Publication number: 20060270194
    Abstract: Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) during the die attachment process and methods for fabricating the same are provided. A method in accordance with the invention comprises providing a semiconductor wafer stack (110) including a plurality of metal pads (112). An adhesion/plating layer (115) is formed on a surface (119) of a substrate (116). A layer of gold (118) is plated on a surface of the adhesion/plating layer (115). The layer of gold is etched in a street area (124) using standard photolithography techniques to expose edge portions (128) of the layer of gold (118) and the adhesion/plating layer (115). A layer of barrier metal (130) is deposited to form an edge seal (129) about the exposed edges (128) of the layer of gold (118) the adhesion/plating layer (115).
    Type: Application
    Filed: May 26, 2005
    Publication date: November 30, 2006
    Inventors: Vasile Thompson, Jason Fender, Terry Daly, Jin-Wook Jang